Display device

ABSTRACT

A display device is provided. The display device includes a display unit which includes a display area and a first hole formed in the display area; and an input sensing unit which is disposed on the display unit and comprises a second hole corresponding to the first hole, the input sensing unit further including: a base layer which includes: an adjacent area disposed adjacent to the second hole and a sensing area overlapping the display area and surrounding the adjacent area; detection electrodes which are disposed on the sensing area; and a first connection wiring which is disposed on the adjacent area, the first connection wire electrically connecting at least two detection electrodes spaced apart by the second hole, disposed at respective sides of the second hole.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a National Stage Entry of International ApplicationNo. PCT/KR2019/001248, filed Jan. 30, 2019, and claims priority from andthe benefit of Korean Patent Application No. 10-2018-0094503, filed onAug. 13, 2018, each of which is incorporated by reference for allpurposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments/implementations of the invention relates to adisplay device including an input sensing unit.

Discussion of the Background

Various display devices used in multimedia devices such as televisions,mobile phones, tablet computers, navigation systems and game machinesare being developed. The display devices include a keyboard or a mouseas an input device. In addition, the display devices include a touchpanel as an input device.

The display devices may further include a camera device, a fingerprintrecognition sensor, etc. The above sensors are generally disposed on aside of a display device, thereby increasing a dead space. However,recently, a notch design is applied to a display device, and a cameradevice, etc. are disposed in a notch area to maximize a display area ofthe display device.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

Devices constructed according to exemplary implementations/embodimentsof the invention are capable of displaying an image on the entire frontsurface and sensing an input by including a hole, in which a sensor suchas a camera device is disposed, in a display area.

However, aspects of the present disclosure are not restricted to the oneset forth herein. The above and other aspects of the present disclosurewill become more apparent to one of ordinary skill in the art to whichthe present disclosure pertains by referencing the detailed descriptionof the present disclosure given below.

According to one or more embodiments of the invention, a display devicecomprising: a display unit which comprises a display area and a firsthole formed in the display area; and an input sensing unit which isdisposed on the display unit and comprises a second hole correspondingto the first hole, wherein the input sensing unit further comprises: abase layer which comprises an adjacent area located adjacent to thesecond hole and a sensing area overlapping the display area andsurrounding the adjacent area; detection electrodes which are disposedon the sensing area; and a first connection wiring which is disposed onthe adjacent area and electrically connects detection electrodes spacedapart by the second hole among the detection electrodes.

In an exemplary embodiment, wherein the detection electrodes comprisesensing electrodes arranged in a first direction and connected to eachother and driving electrodes arranged in a second directionperpendicular to the first direction and connected to each other,wherein a first driving electrode and a second driving electrode spacedapart from each other by the second hole among the driving electrodesare electrically connected by the first connection wiring.

In an exemplary embodiment, electrically connect the sensing electrodesto each other, wherein a first sensing electrode and a second sensingelectrode disposed adjacent to the second hole among the sensingelectrodes are electrically connected to each other by a first adjacentconnection part among the first connection parts, and the first adjacentconnection part is located on a first reference boundary line spacedapart from the second hole by a reference distance.

In an exemplary embodiment, wherein the first connection parts arelocated on one imaginary line, and the first adjacent connection part islocated at an intersection point of the imaginary line and the firstreference boundary line.

In an exemplary embodiment, wherein the input sensing unit furthercomprises: pads which are disposed on a non-sensing area of the baselayer along edges of the sensing area; and sensing lines which areelectrically connected to the pads and are disposed on the non-sensingarea, wherein the first sensing electrode and the second sensingelectrode are electrically connected to two of the pads by two of thesensing lines.

In an exemplary embodiment, wherein a sensing electrode not adjacent tothe second hole among the sensing electrodes is electrically connectedto only one of the sensing lines.

In an exemplary embodiment, wherein the input sensing unit furthercomprises a guard line which is disposed on the adjacent area of thebase layer to form a closed loop along edges of the second hole.

In an exemplary embodiment, wherein each of the sensing electrodes andthe first connection wiring comprises a transparent conductive pattern,and the first connection wiring comprises a metal conductive patterndisposed on the transparent conductive pattern.

In an exemplary embodiment, wherein the input sensing unit furthercomprises a sensing wiring which is connected to an end of one of thedetection electrodes, and a line width of the first connection wiring isgreater than that of the sensing wiring.

In an exemplary embodiment, wherein the input sensing unit furthercomprises a second connection wiring which is disposed on the adjacentarea and electrically connects detection electrodes spaced apart by thesecond hole among the detection electrodes, wherein the line width ofthe first connection wiring is different from that of the secondconnection wiring.

In an exemplary embodiment, wherein the display unit comprises: a firstsubstrate; a second substrate which is disposed opposite the firstsubstrate; a display element layer which is disposed between the firstsubstrate and the second substrate; and a sealing member which isdisposed between the first substrate and the second substrate tosurround the first hole and seal the first substrate and the secondsubstrate, wherein the first connection wiring overlap the sealingmember.

In an exemplary embodiment, the display device further comprising awindow unit which is disposed on the display unit, wherein the windowunit comprises a light shielding pattern overlapping the adjacent area.

In an exemplary embodiment, wherein the display unit comprises wiringsoverlapping the adjacent area, and the first connection wiring overlapsat least two of the wirings.

In an exemplary embodiment, wherein the display unit comprises: a baselayer; and a plurality of dams which are formed adjacent to the firsthole, wherein each of the dams forms a closed loop along edges of thefirst hole, and the first connection wiring overlaps at least one of thedams.

In an exemplary embodiment, wherein the display unit further comprises agroove formed between the dams, wherein the groove is inversely tapered.

According to another exemplary embodiment of the present application, adisplay device comprising: a substrate which comprises a display area, anon-display area disposed along edges of the display area, and a firsthole formed in the display area; a circuit element layer which isdisposed on the substrate and comprises a transistor; a display elementlayer which is disposed on the circuit element layer, overlaps thedisplay area, and comprises a light emitting element electricallyconnected to the transistor; a thin-film encapsulation layer which isdisposed on the display element layer; and an input sensing layer whichis disposed on the thin-film encapsulation layer and comprises detectionelectrodes overlapping the display area and a connection wiringelectrically connecting detection electrodes separated from each otherby the first hole among the detection electrodes, wherein the connectionwiring is located adjacent to the first hole.

In an exemplary embodiment, wherein the detection electrodes comprise ametal conductive layer of a metal mesh pattern, a portion of theconnection wiring which overlaps one of the detection electrodes is ametal mesh pattern, and the detection electrodes do not overlap thelight emitting element.

In an exemplary embodiment, wherein the detection electrodes comprisesensing electrodes arranged in a first direction and connected to eachother and driving electrodes arranged in a second directionperpendicular to the first direction and connected to each other,wherein a first driving electrode and a second driving electrode spacedapart from each other by the second hole among the driving electrodesare electrically connected by the connection wiring.

In an exemplary embodiment, wherein the detection electrodes furthercomprise first connection parts which electrically connect the sensingelectrodes to each other, wherein a first sensing electrode and a secondsensing electrode disposed adjacent to the second hole among the sensingelectrodes are electrically connected to each other by a first adjacentconnection part among the first connection parts, and the first adjacentconnection part is located on a first reference boundary line set basedon the second hole.

In an exemplary embodiment, wherein the first connection parts arelocated on one imaginary line, and the first adjacent connection part islocated at an intersection point of the imaginary line and the firstreference boundary line.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view of a display device according to anembodiment;

FIGS. 2A and 2B are cross-sectional views illustrating examples of thedisplay device taken along line A-A′ of FIG. 1;

FIG. 3 is a plan view illustrating an example of an input sensing panelincluded in the display device of FIG. 2;

FIGS. 4A, 4B, and 4C are enlarged views illustrating an example of afirst area of FIG. 3;

FIG. 5 is a cross-sectional view illustrating an example of the inputsensing panel taken along line B-B′ of FIG. 4A;

FIG. 6 is an enlarged view illustrating an example of area A2 of FIG.4A;

FIGS. 7A and 7B are cross-sectional views illustrating other examples ofthe input sensing panel taken along the line B-B′ of FIG. 4A;

FIGS. 8A and 8B are enlarged views of area A3 of FIG. 4A;

FIG. 9 is an enlarged view of another example of the area A1 of FIG. 3;

FIG. 10 is a plan view illustrating an example of a display panelincluded in the display device of FIG. 2;

FIG. 11 is a circuit diagram illustrating an example of a pixel includedin the display panel of FIG. 10;

FIG. 12 is a cross-sectional view illustrating an example of the displaypanel taken along line C-C′ of FIG. 10;

FIG. 13 is an enlarged cross-sectional view of area A5 of FIG. 12;

FIG. 14 illustrates a process of manufacturing the display panel of FIG.12;

FIG. 15 is an enlarged plan view of area A4 of FIG. 10;

FIG. 16 is a cross-sectional view illustrating an example of the displaydevice taken along line D-D′ of FIG. 15;

FIG. 17 is a cross-sectional view illustrating another example of thedisplay panel taken along the line C-C′ of FIG. 10;

FIGS. 18A, 18B, and 18C are enlarged cross-sectional views of area A5 ofFIG. 17;

FIGS. 19A, 19B, 19C, and 19D are plan views illustrating examples of thedisplay panel of FIG. 17;

FIG. 20 is a cross-sectional view illustrating another example of thedisplay device taken along the line A-A′ of FIG. 1;

FIG. 21 is a cross-sectional view illustrating an example of an inputsensing panel included in the display device of FIG. 20;

FIG. 22 illustrates another example of the display device taken alongthe line A-A′ of FIG. 1;

FIG. 23 is a perspective view of a display device according to anotherembodiment;

FIG. 24 illustrates another example of an input sensing panel includedin the display device of FIG. 23;

FIG. 25 is a cross-sectional view illustrating another example of thedisplay device taken along the line A-A′ of FIG. 1;

FIG. 26 is a plan view of a portion of an input sensing layer includedin the display device of FIG. 25;

FIGS. 27A and 27B are cross-sectional views illustrating examples of theinput sensing layer included in the display device of FIG. 25;

FIG. 28 is a plan view of a portion of a first conductive layer includedin FIG. 27A;

FIG. 29 is an enlarged view of area A7 of FIG. 28;

FIG. 30 is a plan view of a portion of a second conductive layerincluded in FIG. 27A;

FIG. 31 is an enlarged view of area A7 of FIG. 30;

FIG. 32 is an enlarged view of area A6 of FIG. 26; and

FIG. 33 is a cross-sectional view illustrating an example of the inputsensing layer taken along line D-D′ of FIG. 31.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the x, y, and z-axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of X, Y, and Z” and “at leastone selected from the group consisting of X, Y, and Z” may be construedas X only, Y only, Z only, or any combination of two or more of X, Y,and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view of a display device according to anembodiment.

Referring to FIG. 1, a display device 1 may display an image on adisplay surface (or a front surface). The display surface may beparallel to a plane defined by a first directional axis (i.e., an axisextending in a first direction DR1) and a second directional axis (i.e.,an axis extending in a second direction DR2). A normal direction of thedisplay surface, that is, a thickness direction of the display device 1may be defined as a third direction DR3.

The front surface (or upper surface) and back surface (or lower surface)of each member or unit to be described below may be distinguished alongthe third direction DR3. However, the first, second, and thirddirections DR1, DR2, and DR3 illustrated in the current embodiment aremerely an example. The first, second, and third directions DR1, DR2, andDR3 are relative concepts and can be changed to other directions. Thefirst, second, and third directions will hereinafter be indicated by thesame reference numerals.

The display device 1 may include a flat display surface, but the presentdisclosure is not limited to this case. For example, the display device1 may also include a curved display surface or a stereoscopic displaysurface. The stereoscopic display surface may include a plurality ofdisplay areas indicating different directions and include, e.g., apolygonal columnar display surface.

The display device 1 may be a rigid display device. However, the presentdisclosure is not limited to this case. For example, the display device1 may be a flexible display device. In FIG. 1, the display device 1applicable to a mobile phone terminal is illustrated as an example.Although not illustrated in FIG. 1, electronic modules, a camera module,a power module, etc. mounted on a mainboard may be placed in abracket/case together with the display device 1 to form a mobile phoneterminal. The display device 1 is applicable to large-sized electronicdevices such as televisions and monitors as well as to small andmedium-sized electronic devices such as tablet computers, car navigationsystems, game machines and smart watches.

The display surface includes a display area DA where an image isdisplayed and a non-display area NDA adjacent to the display area DA.The non-display area NDA is an area where no image is displayed.

The display area DA may be quadrilateral in shape and have roundedcorners. The non-display area NDA may surround the display area DA.However, the present disclosure is not limited to this case, and theshape of the display area DA and the shape of the non-display area NDAmay be relatively designed.

In embodiments, the display device 1 may include a hole AH (or aninternal groove) formed in the display area DA. As will be describedlater with reference to FIG. 2, the hole AH may penetrate a displaypanel and an input sensing unit (or an input sensing panel) included inthe display device 1 along the third direction DR3. At a positioncorresponding to the hole AH, sensors such as a camera device and aninfrared sensor may be disposed on a bottom side (e.g., on a lowersurface opposite the display surface) of the display device 1.

In FIG. 1, the hole AH has a quadrilateral planar shape with roundedcorners. However, this is merely an example, and the planar shape of thehole AH is not limited to this example. For example, the hole AH mayhave a circular, quadrilateral, or polygonal planar shape. The displaydevice 1 may also include a plurality of holes formed in the displayarea DA.

As described with reference to FIG. 1, the display device 1 may includethe hole AH formed in the display area DA. Thus, the display device 1can have a minimized dead space as compared with a display device havingsensors disposed on one side (e.g., in the non-display area NDA).

FIGS. 2A and 2B are cross-sectional views illustrating examples of thedisplay device taken along line A-A′ of FIG. 1.

Referring to FIG. 2A, FIG. 2A illustrates a cross section defined by thesecond directional axis DR2 and the third directional axis DR3, and FIG.2A schematically illustrates the stacked relationship of functionalpanels and/or functional units constituting the display device 1.

The display device 1 may include a display panel, an input sensing unit,an antireflection unit, and a window unit. At least some of the displaypanel, the input sensing unit, the antireflection unit and the windowunit may be formed by a continuous process or may be bonded to eachother by an adhesive member. Although an optically clear adhesive memberOCA is illustrated in FIG. 2A as an example of the adhesive member, thisis merely an example. The adhesive member to be described below mayinclude a conventional adhesive or gluing agent. In an embodiment of thepresent disclosure, the antireflection unit and the window unit may bereplaced with other units or may be omitted.

Of the input sensing unit, the antireflection unit and the window unit,a unit formed with another unit through a continuous process isexpressed as a “layer”. Of the input sensing unit, the antireflectionunit and the window unit, a unit bonded to another unit by an adhesivemember is expressed as a “panel”. The panel includes a base layer thatprovides a base surface, such as a synthetic resin film, a compositefilm, or a glass substrate. However, the “layer” may not include thebase layer. That is, units expressed as “layers” may be disposed on abase surface provided by another unit.

The input sensing unit, the antireflection unit, and the window unit maybe referred to as an input sensing panel 200, an antireflection panel300 and a window panel 400 or as an input sensing layer, anantireflection layer and a window layer depending on the presence orabsence of the base layer.

Referring to FIG. 2A, the display device 1 may include a display panel100, the input sensing panel 200, the antireflection panel 300, and thewindow panel 400.

The input sensing panel 200 may be disposed on the display panel 100,and the optically clear adhesive member OCA may be disposed between thedisplay panel 100 and the input sensing panel 200. Similarly, theantireflection panel 300 may be disposed on the input sensing panel 200,and the optically clear adhesive member OCA may be disposed between theinput sensing panel 200 and the antireflection panel 300. The windowpanel 400 may be disposed on the antireflection panel 300, and theoptically clear adhesive member OCA may be disposed between theantireflection panel 300 and the window panel 400. The order in whichthe input sensing panel 200 and the antireflection panel 300 are stackedcan be changed.

The hole AH of the display device 1 may penetrate the display panel 100,the input sensing panel 200 and the antireflection panel 300. A cameradevice, an infrared sensor, etc. may be disposed on the lower surface ofthe display device 1 at a position corresponding to a hole area OA(i.e., an area where the hole AH is located).

Each of the display panel 100, the input sensing panel 200 and theantireflection panel 300 may include a hole (or a through hole or anopening) corresponding to the hole AH. Similarly, the optically clearadhesive member OCA disposed between the display panel 100 and the inputsensing panel 200 may include a hole. The size of the hole of theoptically clear adhesive member OCA disposed between the display panel100 and the input sensing panel 200 may be larger than that of the holeAH. For example, a width D2 (or diameter) of the hole of the opticallyclear adhesive member OCA may be greater than a width D1 of the hole AH(or the hole area OA). Similarly, the optically clear adhesive memberOCA disposed between the input sensing panel 200 and the antireflectionpanel 300 may also include a hole, and the size of the hole of theoptically clear adhesive member OCA disposed between the input sensingpanel 200 and the antireflection panel 300 may be equal to or largerthan that of the hole AH.

The window panel 400 may not include a hole and may cover the hole areaOA.

The display panel 100 may generate an image. The display panel 100 maybe, but is not limited to, a light emitting display panel. For example,the display panel 100 may be an organic light emitting display panel ora quantum dot light emitting display panel. A light emitting layer ofthe organic light emitting display panel may include an organic lightemitting material. A light emitting layer of the quantum dot lightemitting display panel may include quantum dots, quantum rods, etc. Thedisplay panel 100 will hereinafter be described as the organic lightemitting display panel.

The input sensing panel 200 may obtain coordinate information of anexternal input (e.g., a touch event). The input sensing panel 200 may bea touch sensing panel that senses a user's touch or a fingerprintsensing panel that senses fingerprint information of a user's finger.The pitch and width of detection electrodes to be described below (i.e.,detection electrodes included in the input sensing panel 200) may bechanged according to the use of the input sensing unit. Detectionelectrodes of the touch sensing panel may have a width of several mm totens of mm, and detection electrodes of the fingerprint sensing panelmay have a width of tens of um to hundreds of μm. The input sensingpanel 200 will hereinafter be described as the touch sensing panel.

The antireflection panel 300 may reduce reflectance of external lightincident from above the window panel 400.

In an embodiment, the antireflection panel 300 may include a retarderand a polarizer. The retarder may be of a film type or a liquid crystalcoating type and may include a λ/2 retarder and/or a λ/4 retarder. Thepolarizer may also be of a film type or a liquid crystal coating type.The film type may include a stretch-type synthetic resin film, and theliquid crystal coating type may include liquid crystals arranged in apredetermined arrangement. Each of the retarder and the polarizer mayfurther include a protective film. The retarder and the polarizerthemselves or the protective films may be defined as a base layer of theantireflection panel 300.

In an embodiment, the antireflection panel 300 may include colorfilters. The color filters may have a predetermined arrangement. Thearrangement of the color filters may be determined in consideration ofemission colors of pixels included in the display panel 100. Theantireflection panel 300 may further include a black matric adjacent tothe color filters.

The window panel 400 may include a base film 410 and a first lightshielding pattern 420. The base film 410 may include a glass substrateand/or a synthetic resin film. The base film 410 may be a single layer.However, the present disclosure is not limited to this case, and thebase film 410 may also include two or more films bonded to each other byan adhesive member.

The first light shielding pattern 420 may partially overlap the basefilm 410. As illustrated in FIG. 2A, the first light shielding pattern420 may overlap edges of the base film 410 and may be disposed on a backsurface of the base film 410 to define a bezel area (e.g., thenon-display area NDA) of the display device 1. The first light shieldingpattern 420 may be a colored organic layer and may be formed by, e.g., acoating method.

In an embodiment, the window panel 400 may further include a secondlight shielding pattern 430. Referring to FIG. 2B, the second lightshielding pattern 430 may overlap an adjacent area AA of the displaydevice 1 and may be disposed on the back surface of the base film 410.Here, the adjacent area AA may be defined as an area disposed alongedges of the hole area OA within the display area DA. The adjacent areaAA may have a generally uniform width along the edges of the hole areaOA. As will be described later, no image is displayed and no input issensed in the adjacent area AA. Accordingly, the adjacent area AA may beclassified as the non-display area NDA. The second light shieldingpattern 430 may be made of a colored organic layer, like the first lightshielding pattern 420.

Although not illustrated separately, the window panel 400 may furtherinclude a functional coating layer disposed on a front surface of thebase film 410. The functional coating layer may include ananti-fingerprint layer, antireflection layer, and a hard coating layer.

Although the input sensing panel 200 overlaps the whole of the displaypanel 100 in FIGS. 2A and 2B, the present disclosure is not limited tothis case. For example, the input sensing panel 200 may overlap only apart of the display area DA of the display panel 100 or may overlap onlythe non-display area NDA.

FIG. 3 is a plan view illustrating an example of the input sensing panelincluded in the display device of FIG. 2. FIGS. 4A, 4B, and 4C areenlarged views illustrating an example of a first area of FIG. 3. FIG.4B illustrates a first conductive layer included in the input sensingpanel 200, and FIG. 4C illustrates a second conductive layer included inthe input sensing panel 200. FIG. 5 is a cross-sectional viewillustrating an example of the input sensing panel taken along line B-B′of FIG. 4A. FIG. 6 is an enlarged view illustrating an example of areaA2 of FIG. 4A.

Referring to FIGS. 3, 4A, 4B, 4C, 5, and 6, the input sensing panel 200may have a multilayer structure. The input sensing panel 200 includesdetection electrodes, signal lines connected to the detectionelectrodes, and at least one insulating layer. The input sensing panel200 may sense an external input using, e.g., a capacitive method. Theoperation method of the input sensing panel 200 is not particularlylimited, and the input sensing panel 200 may also sense an externalinput using an electromagnetic induction method or a pressure sensingmethod.

Referring to FIG. 5, the input sensing panel 200 may include a baselayer 210 (or a first base layer), a first conductive layer 220, a firstinsulating layer 230, a second conductive layer 240, and a secondinsulating layer 250.

Each of the first conductive layer 220 and the second conductive layer240 may have a single layer structure or may have a multilayer structurestacked along the third direction DR3. A conductive layer having asingle layer structure may include a transparent conductive layer. Thetransparent conductive layer may include a transparent conductive oxidesuch as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), or indium tin zinc oxide (ITZO). Alternatively, the transparentconductive layer may include a conductive polymer such as PEDOT, metalnanowires, graphene, etc. However, the present disclosure is not limitedto this case, and the conductive layer may also include a metal layer.The metal layer may include molybdenum, silver, titanium, copper,aluminum, and an alloy of the same. In addition, a conductive layerhaving a multilayer structure may include multiple metal layers. Themetal layers may form, for example, a three-layer structure oftitanium/aluminum/titanium. The conductive layer having the multilayerstructure may also include at least one metal layer and at least onetransparent conductive layer.

The stacked structure and material of the detection electrodes may bedetermined in consideration of sensing sensitivity. Detection electrodesincluding a transparent conductive layer are not visible to a user ascompared with detection electrodes including a metal layer and increasean input area, thereby increasing capacitance. Resistive-capacitive (RC)delay can affect sensing sensitivity. Since the resistance of thedetection electrodes including the metal layer is smaller than that ofthe detection electrodes including the transparent conductive layer, anRC value is reduced. Therefore, the charging time of a capacitor definedbetween the detection electrodes may be reduced.

As will be described later with reference to FIGS. 26, 27A, 27B, 28, 29,30, 31, 32, and 33, the detection electrodes including the metal layermay have a mesh shape. In this case, the metal layer may not be visibleto a user.

Each of the first insulting layer 230 and the second insulating layer250 may have a single layer structure or a multilayer structure. Each ofthe first insulating layer 230 and the second insulating layer 250 mayinclude an inorganic material, an organic material, or a compositematerial.

At least any one of the first insulating layer 230 and the secondinsulating layer 250 may include an inorganic layer. The inorganic layermay include at least one of aluminum oxide, titanium oxide, siliconoxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

At least any one of the first insulating layer 230 and the secondinsulating layer 250 may include an organic layer. The organic layer mayinclude at least any one of acrylic resin, methacrylic resin,polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin,siloxane resin, polyimide resin, polyamide resin, and perylene resin.

Referring to FIG. 3, the input sensing panel 200 may include firstdetection electrodes (or sensing electrodes), second detectionelectrodes (or driving electrodes), first signal lines SL1, secondsignal lines SL2, third signal lines SL3 and fourth signal lines SL4-1and SL4-2. In addition, the input sensing panel 200 may include firstpads IS-PD (or sensing pads) disposed in a first pad area NDA-PD.

The first detection electrodes and the second detection electrodes maybe disposed in a sensing area IS-DA. Here, the sensing area IS-DA maycorrespond to the display area DA and overlap the display area DA.

The first detection electrodes may extend in the second direction DR2and may be repeatedly arranged along the first direction DR1. The seconddetection electrodes may extend in the first direction DR1 and may berepeatedly arranged along the second direction DR2. The first detectionelectrodes may transmit a sensing signal, and the second detectionelectrodes may transmit a detection signal.

The first detection electrodes and the second detection electrodesintersect each other. In this case, the input sensing panel 200 maysense an external input using a mutual cap method and/or a self-capmethod. The input sensing panel 200 may calculate coordinates of anexternal input using the mutual cap method during a first period andthen recalculate the coordinates of the external input using theself-cap method during a second period.

Each of the first detection electrodes includes first sensor parts SP1(or sensing electrodes) and first connection parts CP1 (see FIG. 4B).Similarly, each of the second detection electrodes includes secondsensor parts SP2 (or driving electrodes) and second connection parts CP2(see FIGS. 4A and 4C).

In one first detection electrode, the first sensor parts SP1 may bearranged along the second direction DR2 and may be connected to eachother by the first connection parts CP1. In one second detectionelectrode, the second sensor parts SP2 may be arranged along the firstdirection DR1 and may be connected to each other by the secondconnection parts CP2.

The first signal lines SL1, the second signal lines SL2, the thirdsignal lines SL3 and the fourth signal lines SL4-1 and SL4-2 may bedisposed in a non-sensing area IS-NDA. Here, the non-sensing area IS-NDAmay correspond to the non-display area NDA and overlap the non-displayarea NDA.

The first signal lines SL1 may extend from some of the first pads IS-PDof the first pad area NDA-PD along the non-sensing area IS-NDA locatedon a side (e.g., a right side) of the input sensing panel 200 and may beconnected to ends of the second detection electrodes. The first signallines SL1 may include first through i^(th) driving signal lines SL1-1through SL1-i (where i is an integer equal to or greater than 2), andthe first through i^(th) driving signal lines SL1-1 through SL1-i may beelectrically connected to the ends of the second detection electrodes,respectively.

Similarly, the second signal lines SL2 may extend from some other onesof the first pads IS-PD of the first pad area NDA-PD to a side (e.g., alower side) of the sensing area IS-DA and may be electrically connectedto the other ends of the second detection electrodes. The second signallines SL2 may include first through i^(th) detection signal lines SL2-1through SL2-i, and the first through i^(th) detection signal lines SL2-1through SL2-i may be electrically connected to the other ends of thesecond detection electrodes, respectively.

The third signal lines SL3 may extend from some other ones of the firstpads IS-PD of the first pad area NDA-PD along the non-sensing areaIS-NDA located on the other side (e.g., a left side) of the inputsensing panel 200 and may be electrically connected to ends of the firstdetection electrodes. The third signal lines SL3 may include firstthrough j^(th) sensing signal lines SL3-1 through SL3-j (where j is aninteger equal to or greater than 2), and the first through j^(th)sensing signal lines SL3-1 through SL3-j may be electrically connectedto the ends of the first detection electrodes.

The fourth signal lines SL4-1 and SL4-2 may extend from some other onesof the first pads IS-PD of the first pad area NDA-PD along thenon-sensing area IS-NDA located on a side (e.g., the left side) of theinput sensing panel 200 and may be connected to the other ends of someof the first detection electrodes, respectively. Here, the some of thefirst detection electrodes may be detection electrodes including firstadjacent sensor parts SP_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 andSP1_A23 (see FIG. 4A) disposed adjacent to a first hole AH1.

The input sensing panel 200 including the fourth signal lines SL4-1 andSL4-2 can have improved sensing sensitivity as compared with an inputsensing panel including the third signal lines SL3-1 through SL3-j. Thefirst adjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22and SP1_A23 around the first hole AH1 are generally smaller than thefirst sensor parts spaced apart from the first hole AH1, and no sensorparts are disposed in an area corresponding to the first hole AH1. Inthis case, a sensing signal (or a reception signal) may be dropped orattenuated, leading to a reduction in sensing sensitivity. The inputsensing panel 200 transmits a sensing signal not only through the thirdsignal lines SL3-1 through SL3-j connected to the ends of the firstdetection electrodes but also through the fourth signal lines SL4-1 andSL4-2 connected to the other ends of the first detection electrodesadjacent to the first hole AH1 (that is, transmits a sensing signalthrough both ends of some detection electrodes where a sensing signaldrop can occur), thereby preventing or reducing the drop of the sensingsignal and the resultant reduction of the sensing sensitivity.

The arrangement and connection relationship of the first sensor partsSP1 and the arrangement and connection relationship of the second sensorparts SP2 will be described with reference to FIGS. 4A, 4B, and 4C.

Referring to FIG. 4A, the first sensor parts SP1 may include firstreference sensor parts SP1_R and the first adjacent sensor partsSP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 and SP1_A23. The firstreference sensor parts SP1_R refer to sensor parts spaced apart from thefirst hole AH1 by a specific distance (e.g., the average size of thefirst sensor parts SP1) or more among the first sensor parts SP1. Thefirst adjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22and SP1_A23 may be sensor parts adjacent to the first hole AH1 among thefirst sensor parts SP1.

The first adjacent sensor parts SP1A_A11, SP1_A12, SP1_A13, SP1_A21,SP1_A22 and SP1_A23 may have a different planar shape from the firstreference sensor part SP1_R. In addition, the first adjacent sensorparts SP1_11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 and SP1_A23 may havedifferent shapes from each other and may be partially curved. Further,the first adjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21,SP1_A22 and SP1_A23 may have a size (or area) different from the size(or area) of the first sensor parts SP1.

Referring to FIG. 4B, a (1,1) first adjacent sensor part SP1_A11 may beshaped as a rhombus having a corner (e.g., a corner adjacent to thefirst hole AH1) partially cut off so as to correspond to the shape ofthe first hole AH1. A side of the (1,1) first adjacent sensor partSP1_A11 may be spaced apart from an edge of the first hole AH1 by auniform distance and may include a curved portion corresponding to theshape of the first hole AH1. In addition, the (1,1) first adjacentsensor part SP1_A11 may have a size (or area) smaller than the size (orarea) of the first reference sensor parts SP1_R. a (1,2) first adjacentsensor part SP1_A12 may have a pentagonal planar shape, may not includea curved portion, and may have a relatively small size. (1,3), (2,1),(2,2), and (2,3) first adjacent sensor parts SP1_A13, SP1_A21, SP1_A22,and SP1_A23 may have different planar shapes, may or may not include acurved portion, and may have different sizes.

At least one corner of each of the first adjacent sensor parts SP1_A11,SP1_A12, SP1_A13, SP1_A21, SP1_A22 and SP1_A23 may be located on a firstreference boundary line L_REF1. Here, the first reference boundary lineL_REF1 may be a closed loop line spaced apart from the first hole AH1 bya specific distance (e.g., by 20% to 50% of the length of the firstreference sensor parts SP1_R).

The first adjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21,SP1_A22 and SP1_A23 may be connected to adjacent first sensor parts byfirst adjacent connection parts CP1_11, CP1_12, CP1_13, CP1_21, CP1_22,and CP1_23, respectively. The first adjacent connection parts CP1_11,CP1_12, CP1_13, CP1_21, CP1_22, and CP1_23 may be spaced apart from thefirst hole AH1 by a specific distance and may be located on the firstreference boundary line L_REF1 as illustrated in FIG. 4B.

For reference, the first sensor parts SP1 (or the first reference sensorparts SP1 having the same size and the same shape without being affectedby the first hole AH1) may be repeatedly disposed along the firstdirection DR1 and the second direction DR2. Accordingly, the firstconnection parts CP1 (or first reference connection parts CP1_R)connecting the first sensor parts SP1 may be disposed in intersectionareas of horizontal reference lines LH1, LH2, and LH3 and verticalreference lines LV1, LV2, and LV3.

However, when the intersection areas (or intersection points) of thehorizontal reference lines LH1, LH2, and LH3 and the vertical referencelines LV1, LV2, and LV3 are located inside the first hole AH1 oradjacent to the first hole AH1, the first adjacent connection partsCP1_11, CP1_12, CP1_12, CP1_13, CP1_21, CP1_22, and CP1_23 may be formedin the intersection areas and connect the first adjacent sensor partsSP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 and SP1_A23 to adjacentfirst sensor parts, respectively.

Therefore, as illustrated in FIG. 4B, a first detection electrodeincluding the first adjacent sensor parts SP1_A11, SP1_A12, and SP1_A13(i.e., a detection electrode corresponding to a first horizontalreference line LH1) may bypass the first hole AH1. Similarly, a seconddetection electrode including the second adjacent sensor parts SP1_A21through SP1_A23 (i.e., a detection electrode corresponding to a secondhorizontal reference line LH2) may bypass the first hole AH1.

Referring again to FIG. 4A, the second sensor parts SP2 may includesecond reference sensor parts SP2_R and second adjacent sensor partsSP2A_11, SP2_A12, SP2_A13, SP2_A14, SP2_A22, and SP2_A23. Like the firstreference sensor parts SP1_R, the second reference sensor parts SP2_Rmay refer to sensor parts spaced apart from the first hole AH1 by aspecific distance (e.g., the average size of the second sensor partsSP2) or more among the second sensor parts SP2. The second adjacentsensor parts SP2_A11, SP2_A12, SP2_A13, SP2_A14, SP2_A22, and SP2_A23may be sensor parts adjacent to the first hole AH1 among the secondsensor parts SP2.

The second adjacent sensor parts SP2_A11, SP2_A12, SP2_A13, SP2_A14,SP2_A22, and SP2_A23 may have a different planar shape from the secondreference sensor part SP2_R, may be partially curved, and may have asize (or area) different from the size (or area) of the second referencesensor parts SP2. The planar shape and size of the second adjacentsensor parts SP2A_11, SP2_A12, SP2_A13, SP2_A14, SP2_A22, and SP2_A23are illustrated by way of example in FIG. 4A and have similar featuresto those of the first adjacent sensor parts SP1_A11, SP1_A12, SP1_A13,SP1_A21, SP1_A22 and SP1_A23. Thus, a redundant description will now berepeated.

At least one corner of each of the second adjacent sensor parts SP2A_11,SP2A_12, SP2_A13, SP2_A14, SP2_A22, and SP2_A23 may be located on thefirst reference boundary line L_REF1. The second adjacent sensor partsSP2_A11, SP2_A12, SP2_A13, SP2_A14, SP2_A22, and SP2_A23 may beconnected to adjacent first sensor parts by second adjacent connectionparts CP2_11, CP2_12, CP2_13 CP2_21, CP2_22, and CP2_23.

Referring to FIG. 4C, the second adjacent connection parts CP2_11,CP2_12, CP2_13 CP2_21, CP2_22, and CP2_23 may be spaced apart from thefirst hole AH1 by a specific distance and may be located on the firstreference boundary line L_REF1. The second adjacent connection partsCP2_11, CP2_12, CP2_13 CP2_21, CP2_22, and CP2_23 may be located on adifferent plane (or different layer) from the first adjacent connectionparts CP1_11, CP1_12, CP1_12, CP1_13, CP1_21, CP1_22, and CP1_23 and mayoverlap the first adjacent connection parts CP1_11, CP1_12, CP1_12,CP1_13, CP1_21, CP1_22, and CP1_23, respectively.

As illustrated in FIG. 4C, the second adjacent connection parts CP2_11,CP2_12, CP2_13 CP2_21, CP2_22, and CP2_23 may be disposed inintersection areas of the vertical reference lines LV1, LV2, and LV3 andthe first reference boundary line L_REF1, but the present disclosure isnot limited to this case.

Although the first sensor parts SP1 and the second sensor parts SP2 havea generally rhombic planar shape in FIG. 3, the present disclosure isnot limited to this case. For example, the first sensor parts SP1 andthe second sensor parts SP2 may also have a circular or other polygonalshape. In addition, the first detection electrodes and the seconddetection electrodes including the first sensor parts SP1 and the secondsensor parts SP2 may have a shape (e.g., a bar shape) in which there isno distinction between sensor parts and connection parts.

In embodiments, the input sensing panel 200 may further include firstand second connection wirings CL1 and CL2 (see FIG. 4A) (or first andsecond connection patterns) connecting the second sensor parts SP2adjacent to the first hole AH1, that is, the second adjacent sensorparts SP2_A12, SP2_A13, SP2_A22, and SP2_A23.

The first hole AH1 may have a quadrilateral planar shape with roundedcorners. The length of the first hole AH1 in the second direction DR2may be greater than the length of the first hole AH1 in the firstdirection DR1. For example, the length of the first hole AH1 in thefirst direction DR1 may be similar to the length of the first referencesensor parts SP1_R (or the second reference sensor parts SP2_R), and thelength of the first hole AH1 in the second direction DR1 may be abouttwice the length of the first hole AH1 in the first direction DR1.

In this case, at least one second detection electrode disposed adjacentto the first hole AH1 or intersecting the first hole AH1 may beseparated by the first hole AH1. That is, some of the second sensorparts SP2 constituting the second detection electrode may be spacedapart from each other by the first hole AH1. The connection wirings CL1and CL2 may electrically connect the second sensor parts SP2 spacedapart from each other by the first hole AH1.

The connection wirings CL1 and CL2 may be formed in the same plane (orlayer) as the first sensor parts SP1, the second sensor parts SP2, etc.and may be disposed in an adjacent area IS-AA located adjacent to thefirst hole AH1. The width of the adjacent area IS-AA may be determinedby the size of the first hole AH1. For example, the width of theadjacent area IS-AA may increase as the size of the first hole AH1increases and decrease as the size of the first hole AH1 decreases, butmay be saturated at a specific value.

The first connection wiring CL1 may extend along a side (e.g., the leftside) of the adjacent area IS-AA and may electrically connect a (1,2)second adjacent driving sensor part SP2_A12 (or a twelfth driving sensorpart) and a (2,2) second adjacent driving sensor part SP2_A22 (or atwenty-second driving sensor part). Similarly, the second connectionwiring CL2 may extend along the other side (e.g., the right side) of theadjacent area IS-AA and electrically connect a (1,3) second adjacentdriving sensor part SP2_A13 (or a thirteenth driving sensor part) and a(2,3) second adjacent driving sensor part SP2_A23 (or a twenty-thirddriving sensor part).

Therefore, as illustrated in FIG. 4C, a second detection electrodeincluding the (1,2) second adjacent driving sensor part SP2_A12 and the(2,3) second adjacent driving sensor part SP2_A22 (i.e., a detectionelectrode corresponding to a second vertical reference line LV2) maybypass the first hole AH1. Similarly, a second detection electrodeincluding the (1,3) second adjacent driving sensor part SP2_A13 and the(2,3) second adjacent driving sensor part SP2_A23 (i.e., a detectionelectrode corresponding to a third vertical reference line LV3) maybypass the first hole AH1.

In embodiments, the first and second connection wirings CL1 and CL2 mayhave a specific line width. For example, the line width of the first andsecond connection wirings CL1 and CL2 may be greater than the line width(e.g., several μm) of the signal wirings SL1 through SL4 illustrated inFIG. 4A. The line width of the first and second connection wirings CL1and CL2 will be described later with reference to FIGS. 8A and 8B.

The first and second connection wirings CL1 and CL2 may be arrangedalong relatively short paths and may not overlap each other. However,the present disclosure is not limited to this case. For example, thefirst and second connection wirings CL1 and CL2 may be disposed alongthe same side with respect to the center of the area of the first holeAH1 and may overlap each other or may be adjacent to each other. Thiswill be described later with reference to FIG. 8B.

The input sensing panel 200 may further include a second guard wiringGRL2. The second guard wiring GRL2 may be disposed closer to the firsthole AH1 than the connection wirings CL1 and CL2 in the adjacent areaIS-AA, that is, may be disposed closest to the first hole AH1 among thewirings disposed in the adjacent area AA. The second guard wiring GRL2may protect other wirings (e.g., the connection wirings CL1 and CL2) andthe sensor parts SP1 and SP2 from the shock transmitted from the firsthole AH1, the static electricity flowing from the first hole AH1, etc.

As described above with reference to FIGS. 4A, 4B, and 4C, the firstadjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 andSP1_A23 disposed adjacent to the first hole AH1 may be electricallyconnected to each other by the first adjacent connection parts CP1_11,CP1_12, CP1_12, CP1_13, CP1_21, CP1_22, and CP1_23 disposed on the firstreference boundary line L__REF1 (i.e., a closed loop line spaced apartfrom an edge of the first hole AH1 by a specific distance). In addition,the second adjacent sensor parts SP2_A11, SP2_A12, SP2_A13, SP2_A14,SP2_A22, and SP2_A23 disposed adjacent to or contacting the first holeAH1 may be electrically connected to each other by the connectionwirings CL1 and CL2 disposed in the adjacent area IS-AA.

As described above, a drop of a sensing signal (or a reception signal)due to a change (e.g., a reduction) in the shape, size, or area of thefirst adjacent sensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22and SP1_A23 may be compensated by the fourth signal lines SL4-1 andSL4-2.

The stacked structure of the input sensing panel 200 will now bedescribed in more detail.

Referring to FIG. 5, the first conductive layer 220 includes the firstsensor parts SP1, the second sensor parts SP2, and the first connectionparts CP1. The second sensor parts SP2 may be spaced apart from thefirst connection parts CP1 (or the first sensor parts SP1).

The first conductive layer 220 may further include the first signallines SL1, the first connection wiring CL1 (and the second connectionwiring CL2), and the second guard wiring GRL2. In addition, the firstconductive layer 220 may include the second signal lines SL2 (see FIG.3), the third signal lines SL3 (see FIG. 3) and the fourth signal linesSL4-1 and SL4-2 (see FIG. 3) formed by the same process as the firstsignal lines SL1 and may include the first pads IS-PD (see FIG. 3).

The first sensor parts SP1, the second sensor parts SP2 and the firstconnection parts CP1 may be formed by the same process. The first sensorparts SP1, the second sensor parts SP2 and the first connection partsCP1 may include the same material and may have the same stackedstructure.

The first insulating layer 230 covers at least a portion of each of thefirst sensor parts SP1, the second sensor parts SP2 and the firstconnection parts CP1. In addition, the first insulating layer 230 maycover the first signal lines SL1, the first connection wiring CL1 (andthe second connection wiring CL2), and the second guard wiring GRL2. Thefirst insulating layer 230 may overlap at least a portion of each of thesensing area IS-DA and the non-sensing area IS-NDA.

The first insulating layer 230 may include first insulating patternsIS-ILP, and the first insulating patterns IS-ILP may overlap the firstsensor parts SP1 and the second sensor parts SP2 and may cover the firstconnection parts CP1. Referring to FIG. 6, a first insulating patternIS-ILP may have an area center corresponding to an area center of afirst connection part CP1, may be large enough to cover the firstconnection part CP1, and may cover adjacent corners of first sensorparts SP1 and second sensor parts SP2. The first insulating patternIS-ILP (and the second insulating layer 250 to be described later) mayfill a gap between the first sensor parts SP1 and the second sensorparts SP2 spaced apart from each other. Accordingly, the first sensorparts SP1 and the second sensor parts SP2 may be insulated from eachother. Similarly, sensor parts included in different detectionelectrodes may be insulated by the second insulating layer 250 to bedescribed later.

Referring again to FIG. 5, the second conductive layer 240 includes thesecond connection parts CP2. The second connection parts CP2 areelectrically connected to the second sensor parts SP2 through contactholes CNT. The second connection parts CP2 may include a material havinga resistance lower than that of the second sensor parts SP2. Forexample, the second connection parts CP2 may include the same metalmaterial as the first signal lines SL1.

In embodiments, each of the second connection parts CP2 may include aplurality of sub-connection parts.

Referring to FIG. 6, each of the second connection parts CP2 may includesub-connection parts CP2-1 and CP2-2.

A second connection part CP2 may intersect a first connection part CP1.The width of the second connection part CP2 (i.e., the width in planview) should be minimized in order to reduce the influence of parasiticcapacitance. In this case, a signal (e.g., a transmission signal) may begreatly dropped according to a reduction in the width of the secondconnection part CP2. Therefore, the second connection part CP2 mayinclude a plurality of sub-connection parts CP2-1 and CP2-2 connected inparallel to each other, thereby preventing or reducing the drop of asignal (e.g., a transmission signal). The sub-connection parts CP2-1 andCP2-2 may extend in a fourth direction DR4 different from the firstdirection DR1 and the second direction DR2 and may connect adjacentsecond sensor parts SP2.

Depending on the placement of the second connection part CP2, corners(or most adjacent portions) of the second sensor parts SP2 (and thefirst sensor parts SP1) may be misaligned with the same horizontalreference line (i.e., a line extending in the second direction DR2) (ora vertical reference line extending in the first direction DR1).

Like the second connection part CP2, the width of the first connectionpart CP1 overlapping the second connection part CP2 may be minimized. Asillustrated in FIG. 6, the width of an overlap portion of the firstconnection part CP1 (i.e., a portion overlapping the second connectionpart CP2) may be smaller than the average width of the first connectionpart CP1.

Referring again to FIG, 5, the second insulating layer 250 may bedisposed on the second conductive layer 240 and cover elements disposedunder the second insulating layer 250. At least a portion of the secondinsulating layer 250 may contact the base layer 210, for example, maydirectly contact the base layer 210 at a boundary with the first holeAH1 to insulate sensor parts (e.g., the second sensor parts SP2)included in different detection electrodes adjacent to each other. Inaddition, the second insulating layer 2500 may directly contact the baselayer 210 at an outermost boundary of the non-display area IS-NDA.

The first insulating layer 230 may be a polymer layer, for example, anacrylic polymer layer. The second insulating layer 250 may also be apolymer layer, for example, an acrylic polymer layer. The polymer layercan improve the flexibility of the display device 1 even when the inputsensing panel 200 is disposed on the display panel 100. In order toimprove flexibility, the first sensor parts SP1 and the second sensorparts SP2 may have a mesh shape and include a metal. The first sensorparts SP1 and the second sensor parts SP2 may be referred to as metalmesh patterns.

Although not illustrated in FIG. 5, the connection wirings CL1 may bedisposed not only in the first conductive layer 220 but also in thesecond conductive layer 240, like a connection wiring to be describedlater with reference to FIG. 27A. In this case, a signal drop due to theconnection wirings CL1 can be reduced, and a reduction in sensingsensitivity can be reduced.

As described with reference to FIGS. 3, 4A, 4B, 5, and 6, the inputsensing panel 200 may include the first hole AH1 (i.e., the first holeAH1 formed to correspond to the hole AH of the display device 1 in whicha sensor such as a camera device is disposed), and the first adjacentsensor parts SP1_A11, SP1_A12, SP1_A13, SP1_A21, SP1_A22 and SP1_A23which interfere with the first hole AH1 may be connected to each otheralong the first reference boundary line L_REF1 (i.e., a closed loop linespaced apart from an edge of the first hole AH1 by a specific distance).In addition, the second adjacent sensor parts SP2_A12, SP2_A13, SP2_A22,and SP2_A23 which interfere with the first hole AH1 and are spaced apartfrom each other may be electrically connected to each other by theconnection wirings CL1 and CL2 disposed in the adjacent area AA.

Therefore, while the display device 1 includes the hole AH in thedisplay area DA, it can sense an external input (e.g., a user's touchinput) through the entire display area DA surrounding the hole AH.

In addition, since the input sensing device 200 provides double routing(or multipathing) for first detection electrodes including first sensorparts adjacent to the first hole AH1 (i.e., first detection electrodesinterfering with the first hole AH1) through the fourth signal linesSL4-1 and SL4-2, the drop of a sensing signal and the reduction ofsensing sensitivity can be reduced or prevented.

Further, since the connection wirings CP1 and CP2 and the fourth signallines SL4-1 and SL4-2 electrically connecting the second adjacent sensorparts SP2_A12, SP2_A13, SP2_A22, and SP2_A23 are formed using the samematerial and the same process as the first through third signal wiringsSL1 through SL3, the display device 1 can be manufactured without anadditional manufacturing process or an additional manufacturing cost.

FIGS. 7A and 7B are cross-sectional views illustrating other examples ofthe input sensing panel taken along the line B-B′ of FIG. 4A. In FIGS.7A and 7B, cross sections of the input sensing panel 200 correspondingto FIG. 6 are illustrated.

Referring to FIGS. 3, 4A, 4B, 5, 6, and 7A, an input sensing panel 200_1is substantially the same or similar to the input sensing panel 200described with reference to FIGS. 3, 4A, 4B, 5, and through 6 except fora metal layer 225, and thus a redundant description will not berepeated.

The metal layer 225 may include first metal patterns SL1_M, a secondmetal pattern CL1_M, a third metal pattern GRL1_M, and a fourth metalpattern GRL_M. The metal layer 225 may include molybdenum, silver,titanium, copper, aluminum, and an alloy of the same.

Signal lines SL1 may include a first transparent conductive layer SL1_Tand the first metal patterns SL1_M disposed directly on the firsttransparent conductive patterns SL1_T.

Similarly, a first connection wiring CL1 may include a secondtransparent conductive pattern CL1_T and the second metal pattern CL1_M,and first and second guard wirings GRL1 and GRL2 may include third andfourth transparent conductive patterns GRL1_T and GRL2_T and the thirdand fourth metal patterns GRL1_M and GRL2_M.

Second sensor parts SP2 and first connection parts CP1 (and first sensorparts SP1) may include transparent conductive patterns, but may notinclude metal patterns.

The transparent conductive patterns and the metal patterns may be formedby sequentially forming a preliminary transparent conductive layer and apreliminary metal layer which cover a first conductive layer 220_1 andsequentially patterning the preliminary metal layer and the preliminaryconductive layer.

In this case, the electrical conductivity of the signal lines SL1 andthe first connection wiring CL1 can be improved, the drop of a sensingsignal can be prevented or reduced, and the sensing sensitivity can beimproved.

Referring to FIGS. 7A and 7B, an input sensing panel 2002 issubstantially the same or similar to the input sensing panel 200_1described with reference to FIG. 7A except for a first insulating layer230_1, and thus a redundant description will not be repeated.

The first insulating layer 230_1 may overlap at least a portion of eachof a sensing area IS-DA and a non-sensing area IS-NDA. The firstinsulating layer 230_1 may generally cover a base layer 210, and aboundary portion of the base layer 210 may be exposed by the firstinsulating layer 230. For example, the first insulating layer 230_1 maynot overlap an outermost boundary of the base layer 210 in thenon-display area IS-NDA and may not overlap an inner boundary of thebase layer 210, which is closest to a first hole AH1, in an adjacentarea IS-AA.

Contact holes CNT that partially expose second sensor parts SP2 may beformed in the first insulating layer 230_1. In this case, a secondconductive layer 240 (or second connection parts CP2) may be connectedto the second sensor parts SP2 through the contact holes CNT and mayelectrically connect the second sensor parts SP2 to each other.

FIGS. 8A and 8B are enlarged views of area A3 of FIG. 4A. That is,enlarged views of the adjacent area IS-AA around the first hole AH1 areillustrated in FIGS. 8A and 8B.

Referring to FIG. 8A, the first connection wiring CL1 may be connectedto the (1,2) second adjacent driving sensor part SP2_A12 and the (2,2)second adjacent driving sensor part SP2_A22. For example, the firstconnection wiring CL1 may be formed integrally with the (1,2) secondadjacent driving sensor part SP2_A12 and the (2,2) second adjacentdriving sensor part SP2_A22. For another example, when the firstconnection wiring CL1 includes the second transparent conductive patternCL1_T and the second metal pattern CL1_M as described above withreference to FIG. 7A, the second transparent conductive pattern CL1_Tmay be formed integrally with the (1,2) second adjacent driving sensorpart SP2_A12 and the (2,2) second adjacent driving sensor part SP2_A22,and the second metal pattern CL1_M may be formed on the secondtransparent conductive pattern CL1_T in the adjacent area IS-AA.

A first line width D1 of the first connection wiring CL1 may be greaterthan a reference line width D0 of the second guard wiring GRL2. Here,the reference line width D0 of the second guard wiring GRL2 may besimilar to the line width of the signal wirings SL1 through SL4illustrated in FIG. 4A, for example, may be several μm.

As the first line width D1 of the first connection wiring 1 increases,the resistance of a second detection electrode including the firstconnection wiring CL1 decreases. This prevents or limits reduction ofsensing sensitivity but increases the width of the adjacent area IS-NDA.Therefore, the first line width D1 of the first connection wiring CL1may be 4 to 10 times the reference line width D0, for example, may betens of μm.

Like the first connection wiring CL1, the second connection wiring CL2may be connected to the (1,3) second adjacent driving sensor partSP2_A13 and the (2,3) second adjacent driving sensor part SP2_A23.

A second line width D2 of the second connection wiring CL2 may begreater than the reference line width D0 of the second guard wiringGRL2. Like the first connection wiring CL1, the second line width D2 ofthe second connection wiring CL2 may be 4 to 10 times the reference linewidth D0, for example, may be tens of μm.

In an embodiment, the second line width D2 of the second connectionwiring CL2 may be different from the first line width D1 of the firstconnection wiring CL1.

For example, as illustrated in FIG. 8A, when the length of the secondconnection wiring CL2 in the adjacent area IS-AA is smaller than thelength of the first connection wiring CL1, the second line width D2 ofthe second connection wiring CL2 may be smaller than the first linewidth D1 of the first connection wiring CL1. That is, the second linewidth D2 of the second connection wiring CL2 may be proportional to thelength of the second connection wiring CL2. Similarly, the first linewidth D1 of the first connection wiring CL1 may be proportional to thelength of the first connection wiring CL1.

Referring to FIG. 8B, a second connection wiring CL2_1 may pass througha portion of an adjacent area IS-AA in which a first connection wiringCL1_1 is disposed. In this case, the length of the second connectionwiring CL2_1 may be greater than that of the first connection wiringCL1_1, and a fourth line width D4 of the second connection wiring CL2_1may be greater than a third line width D3 of the first connection wiringCL1.

In FIG. 8B, a gap between the first connection wiring CL1_1 and thesecond connection wiring CL2_1 is smaller than the third line width D3of the first connection wiring CL1_1 (or the fourth line width D4 of thesecond connection wiring CL2_1). However, this is merely an example ofthe third line width D3 of the first connection wiring CL1_1 and theline width D4 of the second connection wiring CL2_1, and the presentdisclosure is not limited to this example.

FIG. 9 is an enlarged view of another example of the area A1 of FIG. 3.

Referring to FIGS. 3, 4A, and 9, an input sensing panel 200 of FIG. 9may be substantially the same as the input sensing panel 200 of FIG. 4Aexcept for a (2,1) second adjacent connection part CP2_21_1.

The (2,1) second adjacent connection part CP2_21_1 may be located on afirst reference boundary line L_REF1 and located between a first pointP1 and a second point P2. Here, the first point P1 may be a point atwhich a second horizontal reference line LH2 corresponding to the (2,1)second adjacent connection part CP2_21_1 intersects the first referenceboundary line L_REF1, and the second point P2 may be a point at which afirst vertical reference line LV1 corresponding to the (2,1) secondadjacent connection part CP2_21_1 intersects the first referenceboundary line L_REF1. The shapes and sizes of adjacent first sensorparts (e.g., a (1,3) first sensor part SP1_A13 and a (2,1) first sensorpart SP1_A21) may be determined or varied according to the position ofthe (2,1) second adjacent connection part CP2_21_1.

FIG. 10 is a plan view illustrating an example of the display panelincluded in the display device of FIG. 2. FIG. 11 is a circuit diagramillustrating an example of a pixel included in the display panel of FIG.10. FIG. 12 is a cross-sectional view illustrating an example of thedisplay panel taken along line C-C′ of FIG. 10. FIG. 13 is an enlargedcross-sectional view of area A5 of FIG. 12. FIG. 14 illustrates aprocess of manufacturing the display panel of FIG. 12.

Referring first to FIG. 12, a display panel 100 includes a firstsubstrate BL and a second substrate ENL disposed opposite the firstsubstrate BL. In addition, the display panel 100 includes a circuitelement layer DP-CL, a display element layer DP-DL and a capping layerCPL disposed on the first substrate BL. The display panel 100 mayfurther include a first sealing member SEAL (or sealant) and a secondsealing member (not illustrated) which seal the first substrate BL andthe second substrate ENL.

Each of the first substrate BL and the second substrate ENL may includea glass substrate, a metal substrate, or an organic/inorganic compositesubstrate. However, the base layer BL is not limited to this example,and each of the first substrate BL and the second substrate ENL may alsoinclude a synthetic resin film.

The element circuit layer DP-CL includes at least one insulating layerand circuit elements. The insulating layer included in the circuitelement layer DP-CL will hereinafter be referred to as an intermediateinsulating layer. The intermediate insulating layer includes at leastone intermediate inorganic layer and at least one intermediate organiclayer. The circuit elements include signal lines, driving circuits ofpixels, etc. The circuit element layer DP-CL may be formed by forming aninsulating layer, a semiconductor layer and a conductive layer throughcoating, deposition or the like and patterning the insulating layer, thesemiconductor layer and the conductive layer through a photolithographyprocess.

The display element layer DP-DL includes light emitting elements. Thedisplay element layer DP-DL may include organic light emitting diodes.The display element layer DP-DL may further include an organic layersuch as a pixel defining layer.

The capping layer CPL may output light emitted from the display elementlayer DP-DL to the outside of the display panel 100. The capping layerCPL may have a refractive index of 1.6 to 2.4.

The first sealing member SEAL may be made of a transparent frit, mayoverlap an adjacent area DP-AA of the display panel 100, and may blockmoisture and oxygen introduced from a second hole AH2. Here, theadjacent area DP-AA of the display panel 100 may correspond to theadjacent area IS-AA of the input sensing panel 200 described withreference to FIG. 3. The first sealing member SEAL may form a closedloop to surround the second hole AH2.

Like the first sealing member SEAL, the second sealing member (notillustrated) may be made of a transparent frit, may overlap anon-display area DP_NDA of the display panel 100, and may block moistureand oxygen introduced from the outside. The second sealing member mayform a rectangular closed loop to surround a display area DP-DA.

In embodiments, an inner side surface of the first substrate BL, aninner side surface of the second substrate ENL and an inner side surfaceof the first sealing member SEAL which contact the second hole AH2 maycoincide or be aligned with each other. That is, the size (orcross-sectional area) of the second hole AH2 may be uniform along thethird direction DR3.

For example, the second hole AH2 may be formed by a hole edge formingprocess, a sealing process, and a hole processing process. The formationprocess of the second hole AH2 will be described with reference to FIG.14.

Referring to FIG. 14, after the circuit element layer DP-CL, the displayelement layer DP-DL and the capping layer CPL are formed on the firstsubstrate BL, the display element layer DP-DL (or an organic layer andan inorganic layer included in the display element layer DP-DL) may beremoved by laser etching to form a groove GRV1. The width of the grooveGRV1 may be greater than that of the first sealing member SEAL. Thefirst sealing member SEAL bonded to the second substrate ENL may beinserted into the groove GRV1 and then bonded to the first substrate BL.Then, the second hole AH2 may be formed by laser cutting, CNC drilling,or the like. Since the second hole AH2 is formed at a time after thesealing process using the first sealing member SEAL, it may have auniform size (or cross-sectional area) along the third direction DR3.

Referring to FIG. 10, the display panel 100 includes the display areaDP-DA and the non-display area DP-NDA in plan view. The non-display areaDP-NDA may be defined along edges of the display area DP-DA. The displayarea DP-DA and the non-display area DP-NDA of the display panel 100respectively correspond to the display area DA and the non-display areaNDA of the display device 1 illustrated in FIGS. 1 and 2.

The display panel 100 may include a driving circuit GDC, signal linesSGL, signal pads DP-PD (or second pads), and pixels PX. The pixels PXare disposed in the display area DA. Here, each of the pixels PX is aminimum unit that displays an image and includes an organic lightemitting diode and a pixel driving circuit connected to the organiclight emitting diode. The driving circuit GDC, the signal lines SGL, thesignal pads DP-PD and the pixel driving circuits may be included in theelement circuit layer DP-CL illustrated in FIG. 10.

The driving circuit GDC may include a scan driving circuit. The scandriving circuit generates scan signals and sequentially outputs the scansignals to scan lines GL to be described later. The scan driving circuitmay further output another control signal to the driving circuits of thepixels PX.

The scan driving circuit may include a plurality of thin-filmtransistors formed by the same process as the driving circuits of thepixels PX, for example, a low-temperature polycrystalline silicon (LTPS)process or a low-temperature polycrystalline oxide (LTPO) process.

The signal lines SGL include the scan lines GL, data lines DL, a powersupply line PL, and a control signal line CSL. The scan lines GL areconnected to corresponding pixels PX, respectively, and the data linesDL are connected to corresponding pixels PX, respectively. The powersupply line PL is connected to the pixels PX. The control signal lineCSL may provide control signals to the scan driving circuit.

The signal lines SGL overlap the display area DP-DA and the non-displayarea DP-NDA. The signal lines SGL may be connected to a pad area NDA-PD(i.e., an area where the signal pads DP-PA are disposed) disposed in thenon-display area DP-NDA and may also be connected to the pixels PX.

Each of the signal lines SGL is connected to transistors T1 and T2 of apixel PX. The signal lines SGL may have a single layer or multilayerstructure and may be formed as a single body or may include two or moreparts. The two or more parts may be disposed on different layers and maybe connected to each other through a contact hole penetrating aninsulating layer disposed between the two or more parts.

The display panel 100 may include the second hole AH2 corresponding tothe hole AH of the display device 1 (or the first hole AH1 of the inputsensing panel 200).

Like the input sensing panel 200 described with reference to FIG. 4A,the adjacent area DP-AA (see FIG. 12) may be defined adjacent to thesecond hole AH2, the pixels PX may not be disposed in the adjacent areaDP-AA, and the signal lines SGL connected to adjacent rows and columns(i.e., pixel rows and pixel columns interfering with the second holeAH2) may bypass the second hole AH2 in the adjacent area. Since thesignal lines SGL bypass the second hole AH2 in substantially the same orsimilar manner to the connection wirings CL1 and CL2 described withreference to FIG. 4A, a redundant description will not be repeated.

A circuit board (not illustrated) may be electrically connected to thepad area NDA-PD. The circuit board may be a rigid circuit board or aflexible circuit board. The circuit board may be directly coupled to thepad area NDA-PD or may be connected to the pad area NDA-PD by anothercircuit board.

Referring to FIG. 11, an organic light emitting diode OLED may be a topemission diode or a bottom emission diode. A pixel PX includes a firsttransistor T1 (or a switching transistor), a second transistor T2 (or adriving transistor), and a capacitor Cst as a pixel driving circuit fordriving the organic light emitting diode OLED.

A first power supply voltage ELVDD is provided to the second transistorT2, and a second power supply voltage ELVSS is provided to the organiclight emitting diode OLED. The second power supply voltage ELVSS may belower than the first power supply voltage ELVDD.

The first transistor T1 outputs a data signal transmitted to a data lineDL in response to a scan signal transmitted to a scan line GL. Thecapacitor Cst is charged with a voltage corresponding to the data signalreceived from the first transistor T1. The second transistor T2 isconnected to the organic light emitting diode OLED. The secondtransistor T2 controls a driving current flowing through the organiclight emitting diode OLED according to the amount of charge stored inthe capacitor Cst.

This equivalent circuit is merely an embodiment, and the pixel PX is notlimited to this embodiment. For example, the pixel PX may include moretransistors and more capacitors. The organic light emitting diode OLEDcan also be connected between the power supply line PL and the secondtransistor T2.

Referring to FIG. 13, the circuit element layer DP-CL, the displayelement layer DP-DL, and the capping layer CPL are sequentially disposedon the first substrate BL.

The element circuit layer DP-CL may include a buffer layer 105 which isan inorganic layer, a first intermediate inorganic layer 110 and asecond intermediate inorganic layer 120 and may include an intermediateorganic layer 130 which is an organic layer. The materials of theinorganic and organic layers are not particularly limited, and thebuffer layer 105 can be optionally placed or omitted.

A semiconductor pattern OSP1 (hereinafter, referred to as a firstsemiconductor pattern) of the first transistor T1 and a semiconductorpattern OSP2 (hereinafter, referred to as a second semiconductorpattern) of the second transistor T2 are disposed on the buffer layer105. The first semiconductor pattern OSP1 and the second semiconductorpattern OSP2 may be selected from amorphous silicon, polysilicon, and ametal oxide semiconductor.

The first intermediate inorganic layer 110 is disposed on the firstsemiconductor pattern OSP1 and the second semiconductor pattern OSP2. Acontrol electrode GE1 (hereinafter, referred to as a first controlelectrode) of the first transistor T1 and a control electrode GE2(hereinafter, referred to as a second control electrode) of the secondtransistor T2 are disposed on the first intermediate inorganic layer110. The first control electrode GE1 and the second control electrodeGE2 may be manufactured by the same photolithography process as the scanlines GL.

In addition, the scan lines GL bypassing the second hole AH2 (or a holearea DP-OA corresponding to the second hole AH2) may be disposed on thefirst intermediate inorganic layer 100 in the adjacent area DP-AA of thedisplay panel 100.

The second intermediate inorganic layer 120 covering the first controlelectrode GE1 and the second control electrode GE2 is disposed on thefirst intermediate inorganic layer 110. An input electrode DE1(hereinafter, referred to as a first input electrode) and an outputelectrode SE1 (hereinafter, referred to as a first output electrode) ofthe first transistor T1 and an input electrode DE2 (hereinafter,referred to as a second input electrode) and an output electrode SE2(hereinafter, referred to as a second output electrode) of the secondtransistor T2 are disposed on the second intermediate inorganic layer120.

The first input electrode DE1 and the first output electrode SE1 areconnected to the first semiconductor pattern OSP1 respectively through afirst through hole CH1 and a second through hole CH2 penetrating thefirst intermediate inorganic layer 110 and the second intermediateinorganic layer 120. The second input electrode DE2 and the secondoutput electrode SE2 are connected to the second semiconductor patternOSP2 respectively through a third through hole CH3 and a fourth throughhole CH4 penetrating the first intermediate inorganic layer 110 and thesecond intermediate inorganic layer 120. One of the first transistor T1and the second transistor T2 can be modified to a bottom gate structure.

In addition, the data lines DL bypassing the second hole AH2 may bedisposed on the second intermediate inorganic layer 120 in the adjacentarea DP-AA of the display panel 100.

The intermediate organic layer 130 covering the first input electrodeDE1, the second input electrode DE2, the first output electrode SE1 andthe second output electrode SE2 is disposed on the intermediate organiclayer 130. The intermediate organic layer may provide a flat surface.

The display element layer DP-DL is disposed on the intermediate organiclayer 130. The display element layer DP-DL may include a pixel defininglayer PDL and the organic light emitting diode OLED. The pixel defininglayer PDL may include an organic material. A first electrode AE isdisposed on the intermediate organic layer 130. The first electrode AEis connected to the second output electrode SE2 through a fifth throughhole CH5 penetrating the intermediate organic layer 130. An opening OPis defined in the pixel defining layer PDL. The opening OP of the pixeldefining layer PDL exposes at least a portion of the first electrode AE.In an embodiment of the present disclosure, the pixel defining layer PDLmay be omitted.

The pixels PX may be disposed in the display area DP-DA. The displayarea DP-DA may include a light emitting region PXA and a non-lightemitting region NPXA adjacent to the light emitting region PXA. Thenon-light emitting region NPXA may surround the light emitting regionPXA. The light emitting region PXA is defined to correspond to a portionof the first electrode AE exposed through the opening OP.

The light emitting region PXA may overlap at least one of the first andsecond transistors T1 and T2. The opening OP can become wider, and thefirst electrode AE and a light emitting layer EML to be described latercan also become wider.

A hole control layer HCL may be disposed common to the light emittingregion PXA and the non-light emitting region NPXA. Although notillustrated separately, a common layer such as the hole control layerHCL may be formed common to the pixels PX.

The light emitting layer EML is disposed on the hole control layer HCL.The light emitting layer EML may be disposed in an area corresponding tothe opening OP. That is, the light emitting layer EML may be formedseparately in each of the pixels PX. The light emitting layer EML mayinclude an organic material and/or an inorganic material. The lightemitting layer EML may generate light of a predetermined color.

In FIG. 13, the patterned light emitting layer EML is illustrated as anexample. However, the light emitting layer EML may also be disposedcommon to the pixels PX. Here, the light emitting layer EML may generatewhite light. In addition, the light emitting layer EML may also have amultilayer structure called a tandem.

An electron control layer ECL is disposed on the light emitting layerEML. Although not illustrated separately, the electron control layer ECLmay be formed common to the pixels PX. A second electrode CE is disposedon the electron control layer ECL. The second electrode CE is disposedcommon to the pixels PX.

A capping layer may be disposed on the second electrode CE.

As described with reference to FIGS. 10, 11, 12, 13, and 14, the displaypanel 100 may include the second hole AH2 corresponding to the hole AHof the display device 1, the pixels PX may not be disposed in theadjacent area DP-AA adjacent to the second hole AH2, and the signallines SGL (e.g., the scan lines GL and the data lines DL) interferingwith the second hole AH2 may bypass the second hole AH2 in the adjacentarea DP-AA.

FIG. 15 is an enlarged plan view of area A4 of FIG. 10. In FIG. 15, theconnection wirings CP1 and CP2 included in the input sensing panel 200of FIG. 3 overlap the data lines DL included in the display panel 100 ofFIG. 10. FIG. 16 is a cross-sectional view illustrating an example ofthe display device taken along line D-D′ of FIG. 15.

Referring first to FIGS. 15 and 16, the input sensing panel 200 isdisposed on the display panel 100. The input sensing panel 200 may besubstantially the same as the input sensing panel 200 described withreference to FIG. 7A, and the display panel 100 may be substantially thesame as the display panel 100 described with reference to FIGS. 12 and13. Thus, a redundant description will not be repeated.

The data lines DL may include first data lines DL1 and second data linesDL2. The first data lines DL1 may bypass the hole AH (or the second holeAH2) in the direction of one side of the center of the area of the holeAH or may pass through the adjacent area AA. The first data lines DL1may include first through i^(th) first data lines DL1_1 through DL1_i(where i is a positive integer).

Similarly, the second data lines DL2 may bypass the hole AH (or thesecond hole AH2) in the direction of the other side of the center of thearea of the hole AH or may pass through the adjacent area AA. The seconddata lines DL2 may include first through (j)^(th) second data linesDL2_1 through DL2_j (where j is a positive integer).

In this case, the first connection wiring CL1 may overlap at least oneof the first data lines DL1, and the second connection wiring CL2 mayoverlap at least one of the second data lines DL2. As described above,each of the first line width D1 of the first connection wiring CL1 andthe second line width D2 of the second connection wiring CL2 is greaterthan the line width of the first data lines DL1 (and/or the line widthof the second data lines DL2). Therefore, each of the first connectionwiring CL1 and the second connection wiring CL2 may overlap a pluralityof data lines.

Referring to FIG. 16, the first connection wiring CL1 and the secondconnection wiring CL2 may overlap the sealing member SEAL. Each of thefirst connection wiring CL1 and the second connection wiring CL2 mayalso partially overlap the sealing member SEAL.

Referring to FIG. 16, the data lines DL may not overlap the second guardwiring GRL2. Here, the data lines DL may include the first data linesDL1 and the second data lines DL2. If the second guard wiring GRL2 is ina floating state or overlaps the data lines DL, parasitic capacitancemay be formed between the second guard wiring GRL2 and the data linesDL, and signal transmission through the data lines DL may be delayed.Therefore, the second guard wiring GRL2 and the data lines DL may notoverlap each other in order to prevent or reduce a delay in signaltransmission through the data lines DL.

FIG. 17 is a cross-sectional view illustrating another example of thedisplay panel taken along the line C-C′ of FIG. 10. FIGS. 18A, 18B, and18C are enlarged cross-sectional views of area A5 of FIG. 17.

Referring to FIGS. 10, 12, 13, and 17, a display panel 100 is differentfrom the display panel 100 described with reference to FIGS. 12 and 13in that it includes a thin-film encapsulation layer TFE instead of asecond substrate ENL, a sealing member SEAL and a capping layer CPL.

The display panel 100 includes a base layer BL (or a second base layer)and a circuit element layer DL-CP, a display element layer DP-DL and thethin-film encapsulation layer TFE disposed on the base layer BL.

The base layer BL may include a synthetic resin film. A synthetic resinlayer is formed on a working substrate used to manufacture the displaypanel 100. Then, a conductive layer and an insulating layer are formedon the synthetic resin layer. If the working substrate is removed, thesynthetic resin layer corresponds to the base layer BL. The syntheticresin layer may be a polyimide resin layer, and its material is notparticularly limited. The base layer BL may include a glass substrate, ametal substrate, or an organic/inorganic composite substrate.

The circuit element layer DP-CL and the display element layer DP-DL mayrespectively be substantially the same or similar to the circuit elementlayer DP-CL and the display element layer DP-DL described above withreference to FIG. 12. Thus, a redundant description will not berepeated.

The thin-film encapsulation layer TFE seals the display element layerDP-DL. The thin-film encapsulation layer TFE includes at least oneinsulating layer. The thin-film encapsulation layer TFE may include atleast one inorganic layer (hereinafter, referred to as an encapsulatinginorganic layer). The thin-film encapsulation layer TFE according to anembodiment of the present disclosure may include at least one organiclayer (hereinafter, referred to as an encapsulating organic layer) andat least one encapsulating inorganic layer. The encapsulating inorganiclayer may protect the display element layer DP-DL from moisture/oxygen.

The display panel 100 may include dams DAM1 and DAM2 formed in anadjacent area DP-AA.

The dams DAM1 and DAM2 may be formed on the base layer BL along theperiphery of a second hole AH2. The dams DAM1 and DAM2 may include afirst dam DAM1 and a second dam DAM2. The first dam DAM1 may be formedadjacent to the second hole AH2. That is, a side surface of the firstdam DAM1 may coincide or be aligned with an inner side surface of thedisplay panel 100 (i.e., a side surface formed by the second hole AH2).The second dam DAM2 may be spaced apart from the first dam DAM1. Thedams DAM1 and DAM2 may block introduction of oxygen and moisture fromthe second hole AH2 and propagation of fine cracks.

Referring to FIG. 18A, the base layer BL may include a first sub-baselayer SUB1 (or a support substrate), a first barrier layer BA1, a secondsub-base layer SUB2 (or a flexible substrate), and a second barrierlayer BA2. The first barrier layer BA1 may be disposed on the firstsub-base layer SUB1, the second sub-base layer SUB2 may be disposed onthe first barrier layer BA1, and the second barrier layer BA2 may bedisposed on the second sub-base layer SUB2. Each of the first and secondsub-base layers SUB1 and SUB2 may include a polymer material (e.g., PI)having flexibility. The first and second barrier layers BA1 and BA2 mayprevent or suppress oxygen and moisture from being introduced from theoutside to the first and second sub-base layers SUB1 and SUB2.

The second sub-base layer SUB2 may include negative PI. In this case,inversely tapered grooves GRV1 and GRV2 may be formed in the secondsub-base layer SUB2 through patterning. That is, protruding tips TIP maybe formed in the grooves GRV1 and GRV2. The inversely tapered groovesGRV1 and GRV2 (and the tips TIP) may cause an organic layer (or anorganic light emitting layer) to be discontinuously formed in a stackingprocess of the display panel 100.

The circuit element layer DP-CL is different from the circuit elementlayer DP-CL described with reference to FIG. 13 in that it furtherincludes a third intermediate inorganic layer 125. Although the circuitelement layer DP-CL includes only a second transistor T2 in FIG. 18A,this is only a schematic illustration of the circuit element layer DP-CLfor ease of description, and the circuit element layer DP-CL may furtherinclude the first transistor T1, etc. illustrated in FIG. 13.

The third intermediate inorganic layer 125 may be disposed between asecond intermediate inorganic layer 120 and an intermediate organiclayer 130. The third intermediate inorganic layer 125 may besubstantially the same or similar to the second intermediate inorganiclayer 120. Data lines DL (or scan lines GL) may be formed on the thirdintermediate inorganic layer 125, but the present disclosure is notlimited to this case. At least some of the data lines DL (or the scanlines GL) can also be formed on the second intermediate inorganic layer120. When the data lines DL (or the scan lines GL) are disposed on afirst intermediate inorganic layer 110, the second intermediateinorganic layer 120 and the third intermediate inorganic layer 130 in adistributed manner, the width of a first non-display area DP-NDA1 may bereduced. Here, the first non-display area DP-NDA1 may be a portion of anadjacent area D-AA excluding the first and second dams DAM1 and DAM2 andthe first and second grooves GRV1 and GRV2.

The dams DAM1 and DAM2 may include the circuit element layer DP-CL.However, the intermediate organic layer 130 may not be formed in thedams DAM1 and DAM2.

The thin-film encapsulation layer TFE may overlap the whole of the baselayer BL. The thin-film encapsulation layer TFE may extend from adisplay area DP-DA to the second hole AH2 and may be disposed along thefirst and second grooves GRV1 and GRV2 and sidewalls formed by the firstand second dams DAM1 and DAM2. In this case, the inflow path of moistureand oxygen and/or propagation path of cracks through the thin-filmencapsulation layer TFE are increased, and the reliability and stabilityof the display device 1 can be improved.

The thin-film encapsulation layer TFE may include a first encapsulatinginorganic layer IOL1, a first encapsulating organic layer OL1, and asecond encapsulating inorganic layer IOL2 stacked sequentially. Each ofthe first encapsulating inorganic layer IOL1 and the secondencapsulating inorganic layer IOL2 may be a single layer including amaterial or may have multiple layers including different materials. Atleast one of the first encapsulating inorganic layer IOL1 and the secondencapsulating inorganic layer IOL2 may include a silicon nitride layer,a silicon oxynitride layer, a silicon oxide layer, a titanium oxidelayer, or an aluminum oxide layer.

The encapsulating organic layer OL1 may be formed by depositing organicmonomers. Here, the organic monomers may include, but are not limitedto, acrylic monomers.

For example, the thin-film encapsulation layer TFE may include a siliconoxynitride layer/an organic monomer layer/a silicon nitride layerstacked sequentially on a second electrode CE. Another inorganic layermay be disposed on the silicon nitride layer, and the silicon nitridelayer may have multiple layers (e.g., two layers) deposited underdifferent conditions.

In embodiments, the encapsulating organic layer OL1 may overlap thedisplay area DP-DA and the first non-display area DP-NDA1 and may notoverlap the first and second grooves GRV1 and GRV2 and the first andsecond dams DAM1 and DAM2. In this case, the first and secondencapsulating inorganic layers IOL1 and IOL2 may overlap the first andsecond grooves GRV1 and GRV2 and the first and second dams DAM1 andDAM2. In this case, the inflow path of moisture and oxygen may berelatively long.

However, the above is merely an example, and the thin-film encapsulationlayer TFE is not limited to this example.

The encapsulating organic layer OL1 may also overlap the second grooveGRV2 and partially overlap the second dam DAM2 as illustrated in FIG.18B. In addition, the encapsulating organic layer OL1 may also overlapthe first and second grooves GRV3 and the second dam DAM1 and partiallyoverlap the first dam DAM1 as illustrated in FIG. 18C. In this case, anupper surface of the thin-film encapsulation layer TFE may be relativelyflat, and an input sensing layer to be described later (i.e., an inputsensing layer formed through a continuous process after the process offorming the thin-film encapsulation layer TFE) can be formed more easilyon the thin-film encapsulation layer TFE.

In FIGS. 17, 18A, 18B, and 18C, the display panel 100 includes two damsDAM1 and DAM2. However, this is merely an example, and the presentdisclosure is not limited to this example. For example, the displaypanel 100 may include three or more dams.

FIGS. 19A, 19B, 19C, and 19D are plan views illustrating examples of thedisplay panel of FIG. 17. In FIGS. 19A, 19B, 19C, and 19D, a displaypanel 100 (or dams DAM1 and DAM2 of the display panel 100) overlaps aninput sensing panel 200 (or first and second connection wirings CL1 andCL2 of the input sensing panel 200) in the area A4 of FIG. 10.

Referring to FIG. 19A, a first connection wiring CL1 may overlap asecond dam DAM2. A first line width D1 of the first connection wiringCL1 may be smaller than a second width D2 of the second dam DAM2 (i.e.,a gap between first and second grooves GRV1 and GRV2). For example, ifthe display panel 100 has the cross-sectional structure illustrated inFIG. 18A and the second width D2 of the second dam DAM2 is sufficientlylarge, the first connection wiring CL1 may overlap the second dam DAM2.The first connection wiring CL1 may overlap a first non-display areaDP-NDA1 as illustrated in FIG. 19D. In this case, the first connectionwiring CL1 may overlap a data wiring DL and/or a scan signal line GL ofthe display panel 100. In addition, although not illustrated, the firstconnection wiring CL1 may overlap a first dam DAM1.

Referring to FIG. 19B, a first connection wiring CL1 may cover a seconddam DAM2. A first line width D1_1 of the first connection wiring CL1 maybe greater than a second width D2_2 of the second dam DAM2 (i.e., a gapbetween first and second grooves GRV1 and GRV2). For example, if thedisplay panel 100 has the structure illustrated in FIG. 18B or thecross-sectional structure illustrated in FIG. 18C and the second widthD2 of the second dam DAM2 is relatively small, the first connectionwiring CL1 may cover the second dam DAM2.

Referring to FIG. 19C, a first connection wiring CL1 may partiallyoverlap a second dam DAM2.

FIG. 20 is a cross-sectional view illustrating another example of thedisplay device taken along the line A-A′ of FIG. 1. FIG. 21 is across-sectional view illustrating an example of an input sensing panelincluded in the display device of FIG. 20. FIG. 22 illustrates anotherexample of the display device taken along the line A-A′ of FIG. 1.

Referring to FIGS. 2 and 20, a display device 1_1 is different from thedisplay device 1 of FIG. 2 in that it includes an antireflection panel300 disposed on a display panel 100 and an input sensing panel 200disposed on the antireflection panel 300. That is, the stacking order ofthe input sensing panel 200 and the antireflection panel 300 included inthe display device 1_1 is different from that of the input sensing panel200 and the antireflection panel 300 included in the display device 1 ofFIG. 2.

The display panel 100 may be substantially the same as the display panel100 described with reference to FIGS. 2, 10, 11, 12, 13, 14, and 17.Therefore, a redundant description will not be repeated. Theantireflection panel 300 and a window panel 400 may be substantially thesame or similar to the antireflection panel 300 and the window panel 400described with reference to FIGS. 2A and 2B.

The input sensing panel 200 is different from the input sensing panel200 described with reference to FIGS. 3 through 6 in that it includes aconductive layer IS-CP (or a first connection wiring CL1), first signallines SL1, and first and second guard wirings GRL1 and GRL2. The planview of the input sensing panel 200 may be substantially the same as theplan view illustrated FIG. 3. In FIG. 21, a cross section of the inputsensing panel 200 taken along the line B-B′ of FIG. 3 is illustrated.

Referring to FIG. 21, the input sensing panel 200 is different from theinput sensing panel 200 of FIG. 5 in that it does not include a secondinsulating layer 250 and includes a third conductive layer 260. A firstinsulating layer 230 included in the input sensing panel 200 may includeonly insulating patterns IS-ILP, and the insulating patterns IS-ILP maybe disposed on a first conductive layer 220 and may be disposed only inoverlap areas between first connection parts CP1 and second connectionparts CP2.

The third conductive layer 260 may be disposed on a base layer 210 in anon-sensing area IS-NDA and an adjacent area IS-AA and may include thefirst connection wiring CP1, the first signal lines SL1 and the firstand second guard wirings GRL1 and GRL2.

The third conductive layer 260 may include a metal layer, and the metallayer may include may include molybdenum, silver, titanium, copper,aluminum, and an alloy of the same. Since the third conductive layer 260includes only the metal layer, it has lower resistance than atransparent conductive layer of the same thickness as the thirdconductive layer 260 and can reduce the delay and attenuation of asignal transmitted through the first connection wiring CP1, the firstsignal lines SL1 and the first and second guard wirings GRL1 and GRL2.

Referring again to FIG. 20, the third conductive layer 260 may bedisposed on an upper surface of the base layer 210 and may face thewindow panel 400. However, the input sensing panel 200 is not limited tothis example.

Referring to FIG. 22, a conductive layer IS-CP (or a third conductivelayer 260) may be disposed on a lower surface of a base layer 210 andmay face an antireflection panel 300. The stress due to the bending of adisplay device 1 may be alleviated depending on the position of thethird conductive layer IS-CP (or the third conductive layer 260).

The overlapping relationship between the first connection wiring CL1included in the input sensing panel 200 of FIGS. 20, 21, and 22 andsignal wirings (e.g., data wirings) and/or data wirings included in thedisplay panel 100 may be substantially the same or similar to theoverlapping relationship described with reference to FIGS. 15, 16, and19A through 19D.

FIG. 23 is a perspective view of a display device according to anotherembodiment. FIG. 24 illustrates another example of an input sensingpanel included in the display device of FIG. 23. In FIG. 24, an enlargedview of a portion of the input sensing panel 200 corresponding to FIG.4A (i.e., a portion corresponding to the area A1 of FIG. 4A) isillustrated.

Referring to FIGS. 1, 3, 4A, 23, and 24, an input sensing panel 200_1 isdifferent from the input sensing panel 200 of FIG. 4A (or the inputsensing panel 200 of FIG. 3) in that it includes two active holes AH1_1and AH1_2.

First and second active holes AH1_1 and AH1_2 may be formed at aposition corresponding to the first hole AH1 described with reference toFIG. 4A.

Each of the first and second active holes AH1_1 and AH1_2 may have acircular planar shape and may have a size similar to the size of sensorparts SP1 and SP2. However, this is merely an example, and the first andsecond active holes AH1_1 and AH1_2 are not limited to this example. Forexample, the first and second active holes AH1_1 and AH1_2 may have apolygonal shape such as a square or a rectangle or may have a size equalto or larger than the size of the first hole AH1.

First, the first active hole AH1_1 may overlap a first verticalreference line LV1 (i.e., one of the imaginary lines extending in thefirst direction DR1, on which second connection parts CP2 or firstconnection parts CP1 are located or which connect the second connectionparts CP2 or the first connection parts CP1) and a second horizontalreference line LH2 (i.e., one of the imaginary lines extending in thesecond direction DR2, on which the second connection parts CP2 or thefirst connection parts CP1 are located). That is, a first intersectionpoint of the first vertical reference line LV1 and the second horizontalreference line LH2 may be disposed within the first active hole AH1_1 oradjacent to the first active hole AH1_1.

Accordingly, a 221^(st) adjacent connection part CP2_21 corresponding tothe first intersection point (or a first connection part CP1 overlappingthe 221^(st) adjacent connection part CP2_21, although not illustrated)may be disposed at an intersection point of the first vertical referenceline LV1 and a first sub-boundary line L_REF1_1. Here, the firstsub-boundary line L_REF1_1 may be a closed loop line spaced apart froman edge of the first active hole AH1_1 by a specific distance, like thefirst reference boundary line L_REF1 described with reference to FIG.4A.

Adjacent sensor parts (e.g., a 121^(st) sensor part SP1_B21, a 122^(nd)sensor part SP1_B22, a 211^(th) sensor part SP2_B11 and a 231^(st)sensor part SP2_31) may have different shapes and/or sizes from firstreference sensor parts CP1_R (and/or second reference sensor partsCP2_R) depending on the position of the 221^(st) adjacent connectionpart CP2_21.

The 121^(st) sensor part SP1_B21 and the 122^(nd) sensor part SP1_B22may be directly connected to each other depending on the position of the221^(st) adjacent connection part CP2_21.

Since adjacent second sensor parts (e.g., the 211^(th) sensor partSP2_B11 and a 212^(th) sensor part SP2_B12) are not separated by thefirst active hole AH1_1, no connection wiring may be disposed in a firstadjacent area (i.e., an adjacent area surrounding the first active holeAH1_1). A second sub-guard wiring GRL2_1 may be disposed in the firstadjacent area in order to prevent or reduce inflow of physical shock,static electricity, etc. from the first active hole AH1_1.

Like the first active hole AH1_1, the second active hole AH1_2 mayoverlap a third vertical reference line LV3, a first horizontalreference line LH1 and the second horizontal reference line LH2. Thatis, a second intersection point of the third vertical reference line LV3and the first horizontal reference line LH1 may be disposed within thesecond active hole AH1_2 or adjacent to the second active hole AH1_2,and a third intersection point of the third vertical reference line LV3and the second horizontal reference line LH2 may be disposed within thesecond active hole AH1_2 or adjacent to the second active hole AH1_2.

Accordingly, a 213^(th) adjacent connection part CP2_13 corresponding tothe second intersection point may be disposed at one of the intersectionpoints of the third vertical reference line LV3 and a secondsub-boundary line L_REF1_2. Similarly, a 222^(nd) adjacent connectionpart CP2_22 corresponding to the third intersection point may bedisposed at another one of the intersection points of the third verticalreference line LV3 and the second sub-boundary line L_REF1_2.

Therefore, a 112^(th) sensor part SP1_B12 and a 113^(th) sensor partSP1_B13 may be directly connected to each other by the 213^(th) adjacentconnection part CP2_13, and a 123^(rd) sensor part SP1_B23 and a124^(th) sensor part SP_B24 may be directly connected to each other bythe 222^(nd) adjacent connection part CP2_22.

Adjacent second sensor parts (e.g., a 213^(th) sensor part SP2_B13 and a223^(rd) sensor part SP2_B23) may be separated by the second active holeAH1_2. Therefore, a third connection wiring CL3 may be disposed in anadjacent area surrounding the second active hole AH1_2 and mayelectrically connect the 213^(th) sensor part SP2_B13 and the 223^(rd)sensor part SP2_B23.

The third connection wiring CL3 is substantially the same or similar toone of the first and second connection wirings CL1 and CL2 describedwith reference to FIG. 4A, and thus a redundant description will not berepeated.

As described with reference to FIGS. 23 and 24, even if the shape, sizeand number (or quantity) of the hole AH of the display device 1 ischanged, connection parts interfering with the hole AH (i.e., the firstand second connection parts CP1 and CP2) may be disposed on thesub-boundary lines L_REFR1_1 and L_REF1_2 set based on the hole AH, andthe sensor parts SP1 and SP2 may be disposed accordingly. In addition, aconnection wiring (e.g., the third connection wiring CL3) electricallyconnecting separated second sensor parts SP2 may be disposed in anadjacent area IS-AA adjacent to the hole AH (e.g., the second activehole AH1_2). Therefore, while the display device 1 includes the hole AHin a display area DA, it can sense an external input (e.g., a user'stouch input) through the entire display area DA surrounding the hole AH.

FIG. 25 is a cross-sectional view illustrating another example of thedisplay device taken along the line A-A′ of FIG. 1. FIG. 26 is a planview of a portion of an input sensing layer included in the displaydevice of FIG. 25. FIGS. 27A and 27B are cross-sectional viewsillustrating examples of the input sensing layer included in the displaydevice of FIG. 25. FIG. 28 is a plan view of a portion of a firstconductive layer included in FIG. 27A. FIG. 29 is an enlarged view ofarea A7 of FIG. 28. FIG. 30 is a plan view of a portion of a secondconductive layer included in FIG. 27A. FIG. 31 is an enlarged view ofarea A7 of FIG. 30. FIG. 32 is an enlarged view of area A6 of FIG. 26.FIG. 33 is a cross-sectional view illustrating an example of the inputsensing layer taken along line D-D′ of FIG. 31.

First, referring to FIGS. 1, 2, and 25, a display device 1_4 isdifferent from the display device 1 of FIG. 2 in that it includes adisplay module 10 (or a display panel) and that the display module 10includes a display panel 100 a and an input sensing layer 200 a. Thedisplay device 1_4 is substantially the same or similar to the displaydevice 1 of FIG. 2 except for the input sensing layer 200 a, and thus aredundant description will not be repeated. Elements corresponding toreference numerals identical or similar to the above-described referencenumerals are substantially the same as the above-described elements, andthus a redundant description will not be repeated.

The input sensing layer 200 a may be directly disposed on the displaypanel 100 a. As described above, when the input sensing layer 200 a isdirectly disposed on the display panel 100 a, it means that no adhesivelayer/adhesive member is disposed between the input sensing layer 200 aand the display panel 100 a. That is, after the formation of the displaypanel 100 a, the input sensing layer 200 a may be formed on the displaypanel 100 a (e.g., a thin-film encapsulation layer TFE of the displaypanel 100 a) through a continuous process.

An antireflection panel 300 may be attached onto the display module 10by an optically clear adhesive member OCA.

Referring to FIGS. 26, 27A, 27B, 28, 29, 30, and 31, the input sensinglayer 200 a includes a first input sensing layer 200 a-1 disposed on thedisplay panel 100 a and a second input sensing layer 200 a-2 disposed onthe first input sensing layer 200 a-1. In FIG. 27A, a cross-section ofthe input sensing layer 200 a corresponding to FIG. 5 is illustrated. InFIG. 28, the first input sensing layer 200 a-1 corresponding to FIG. 4Bis illustrated. In FIG. 30, the second input sensing layer 200 a-2corresponding to FIG. 4C is illustrated.

Referring to FIG. 28, the first input sensing layer 200 a-1 may includesecond connection parts CP2. In addition, the first input sensing layer200 a-1 may include first signal lines SL1, a first connection wiringCL1, and first and second guard wirings GRL1 and GRL2.

Referring to FIG. 29, a first connection part CP1 may be a metal meshpattern. A first signal line SL1 may be a wiring having a specific linewidth. However, the present disclosure is not limited to this case. Whenthe first signal line SL1 overlaps a sensing area IS-DA, a portion ofthe first signal line SL1 which overlaps the sensing area IS-DA may havea metal mesh pattern. Similarly, the first connection wiring CL1 may bea wiring having a specific line width. However, the present disclosureis not limited to this case. Like the first signal line SL1, the firstconnection wiring CL1 may also have a metal mesh pattern in a portion.

Although the line width of the first connection wiring CL1 (i.e., thewidth in an adjacent area IS-AA) is similar to the line width of thefirst signal line SL1 (i.e., the line width in a non-sensing areaIS-NDA), the present disclosure is not limited to this case. Asdescribed above, the line width of the first connection wiring CL1 maybe 4 to 10 times the line width of the first signal line SL1.

Referring to FIG. 27A, a first insulating layer 230 may be disposed onthe first input sensing layer 200 a-1 and may cover first connectionparts CP1. Referring to FIG. 28, at least one contact hole CNT-D1,CNT-D2, CNT-D3 or CNT-D4 may be formed in each of the areas of the firstinsulating layer 230 which overlap both ends of the first connectionpart CP1, an end of the first connection wiring CL1, and an end of thefirst signal wiring SL1.

Referring to FIGS. 27A and 30, the second input sensing layer 200 a-2may include first sensor parts SP1, second sensor parts SP2, and firstconnection parts CP1.

The shape and size of the first sensor parts SP1 and the shape and sizeof the second sensor parts SP2 are substantially the same as the shapeand size of the first sensor parts SP1 and the shape and size of thesecond sensor parts SP2 described with reference to FIG. 4A, and thus aredundant description will not be repeated.

The second sensor parts SP2 may be connected to the second connectionparts CP2 through first contact holes CNT-D1 (or third contact holesCNT-D3). The second sensor parts SP2 may be connected to the firstsignal wirings SL1 through second contact holes CNT-D2 or may beelectrically connected to the first connection wiring CL1 through fourthcontact holes CNT-D4.

In embodiments, the first signal lines SL1, the first connection wiringCL1 and the first and second guard wirings GRL1 and GRL2 may be disposedin at least one of the first input sensing layer 200 a-1 and the secondinput sensing layer 200 a-2.

For example, referring to FIG. 27B, the first signal lines SL1, thefirst connection wiring CL1 and the first and second guard wirings GRL1and GRL2 may be disposed in each of the first input sensing layer 200a-1 and the second input sensing layer 200 a-2 and may be connected tocorresponding elements through connection contact holes CNT-S. In thiscase, resistance values of the first signal lines SL1 and the firstconnection wiring CL1 may be reduced, thereby improving the sensingsensitivity of the input sensing layer 200 a. In addition, the first andsecond guard wirings GRL1 and GRL2 can more effectively block the inflowof physical shock, static electricity, etc. from the periphery of theinput sensing layer 200 a (e.g., a hole AH1).

In addition, like the first input sensing layer 200 a-1, the secondinput sensing layer 200 a-2 may include the first signal lines SL1, thefirst connection wiring CL1, and the first and second guard wirings GRL1and GRL2.

Referring again to FIG. 28, first adjacent connection parts CP1_11,CP1_12, CPI1_12, CP1_13, CP1_21, CP1_22, and CP1_23 may be spaced apartform a first hole AH1 by a specific distance and may be located on afirst reference boundary line L_REF1. As described above, secondadjacent connection parts CP2_11, CP2_12, CP2_13, CP2_21, CP2_22 andCP2_23 may respectively be disposed at intersection points (orintersection areas) of the first reference boundary line L_REF1 andfirst through third vertical reference lines LV1, LV2, and LV3.

Similarly, the second adjacent connection parts CP2_11, CP2_12, CP2_13,CP2_21, CP2_22 and CP2_23 may be disposed on the first referenceboundary line L_REF1.

The first adjacent connection parts CP1_11, CP1_12, CP1_21, CP1_22, andCP1_23 may overlap the second adjacent connection parts CP2_12, CP2_13,CP2_21, CP2_22 and CP2_23 and may respectively be disposed at theintersection points (or intersection areas) of the first referenceboundary line L_REF1 and the first through third vertical referencelines LV1, LV2, and LV3.

The shapes and sizes of adjacent sensor parts SP1_A11, SP1_12, SP1_A13,SP1_A21, SP1_A22, SP1_A23, SP2_A12, SP2_A13, SP2_A22, and SP2_A23 may bedetermined by the arrangement of the first adjacent connection partsCP1_11, CP1_12, CP1_21, CP1_22, and CP1_23 and the second adjacentconnection parts CP2_11, CP2_12, CP2_13, CP2_21, CP2_22 and CP2_23.

First adjacent sensor parts SP1_A11, SP1_12, SP1_A13, SP1_A21, SP1_A22and SP1_A23 may be directly connected to each other by the firstadjacent connection parts CP1_11, CP1_12, CP1_21, CP1_22, and CP1_23 andmay be electrically connected to fourth signal lines SL4-1 and SL4-2described above.

Second adjacent sensor parts SP2_A12, SP2_A13, SP2_A22, and SP2_A23 maybe electrically connected by the first and second connection wirings CL1and CL2.

Accordingly, parasitic capacitance between first and second detectionelectrodes may be reduced. In addition, since the first and seconddetection electrodes do not overlap light emitting regions PXA-R, PXA-G,and PXA-B (i.e., areas where light is emitted from pixels PX), they maynot be visible to a user of the display device 1_1.

The first and second detection electrodes having a mesh shape mayinclude, but are not limited to, silver, aluminum, copper, titanium,nickel, titanium, etc. that can be processed at low temperature. Even ifthe input sensing layer 200 a is formed by a continuous process, thedamage to organic light emitting diodes OLED included in the displaypanel 100 a can be prevented or reduced.

Referring to FIGS. 32 and 33, a first sensor parts SP1 may not overlapthe light emitting regions PXA-R, PXA-G, and PXA-B and may overlap anon-light emitting region NPXA. Each of the light emitting regionsPXA-R, PXA-G, and PXA-B may be defined the same as the light emittingregion PXA illustrated in FIG. 6.

Mesh lines of the first sensor part SP1 may define a plurality of meshholes IS-OPR, IS-OPG and IS-OPB (hereinafter, referred to as meshholes). The mesh lines may have a three-layer structure oftitanium/aluminum/titanium. The mesh holes IS-OPR, IS-OPG, and IS-OPBmay correspond one-to-one to the light emitting regions PXA-R, PXA-G,and PXA-B.

The light emitting regions PXA-R, PXA-G, and PXA-B may be divided into aplurality of groups according to the colors of light generated from theorganic light emitting diodes OLED. In FIG. 18, the light emittingregions PXA-R, PXA-G, and PXA-B are divided into three groups accordingto emission colors.

The light emitting regions PXA-R, PXA-G, and PXA-B may have differentareas according to the colors of light emitted from light emittinglayers EML of the organic light emitting diodes OLED. The areas of thelight emitting regions PXA-R, PXA-G, and PXA-B may be determined by thetypes of the organic light emitting diodes.

The mesh holes IS-OPR, IS-OPG and IS-OPB may be divided into a pluralityof groups having different areas. The mesh holes IS-OPR, IS-OPG andIS-OPB may be divided into three groups according to the correspondinglight emitting regions PXA-R, PXA-G, and PXA-B.

Although the mesh holes IS-OPR, IS-OPG and IS-OPB are illustrated ascorresponding one-to-one to the light emitting regions PXA-R, PXA-G, andPXA-B, the present disclosure is not limited to this case. Each of themesh holes IS-OPR, IS-OPG and IS-OPB may also correspond to two or morelight emitting regions PXA-R, PXA-G, and PXA-B.

Although the light emitting regions PXA-R, PXA-G, and PXA-B areillustrated as having various areas, the present disclosure is notlimited to this case. The light emitting regions PXA-R, PXA-G, and PXA-Bmay also have the same size, and the mesh holes IS-OPR, IS-OPG andIS-OPB may also have the same size. The planar shape of the mesh holesIS-OPR, IS-OPG and IS-OPB is not limited and may have a polygonal shapedifferent from a rhombus. The planar shape of the mesh holes IS-OPR,IS-OPG and IS-OPB may also be a polygonal shape with rounded corners.

The overlapping relationship between the first connection wiring CL1illustrated in FIG. 29 and signal wirings (e.g., data wirings) and/ordata wrings included in the display panel 100 a may be substantially thesame or similar to the overlapping relationship described with referenceto FIGS. 15, 16, 19A, 19B, 19C, and 19D.

According to exemplary embodiments of the present disclosure, detectionelectrodes (or first adjacent sensor parts, sensing electrodes)interfered with a hole are connected to each other along a closed loopline spaced apart from an edge of the hole at a specific distance, anddetection electrodes (or second adjacent sensor parts, drivingelectrodes) interfered with the hole and spaced apart from each otherare electrically connected by a connection wiring disposed adjacent tothe hole. Therefore, a display device can sense an external inputthrough the entire display area surrounding the hole while including thehole in the display area.

In addition, double routing (or multipathing) is provided for detectionelectrodes interfering with the hole, thereby reducing the drop of asensing signal and the reduction of sensing sensitivity.

However, the effects of the embodiments are not restricted to the oneset forth herein. The above and other effects of the embodiments willbecome more apparent to one of daily skill in the art to which theembodiments pertain by referencing the claims.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

1. A display device comprising: a display unit which comprises a displayarea and a first hole formed in the display area; and an input sensingunit which is disposed on the display unit and comprises a second holecorresponding to the first hole, the input sensing unit furthercomprising: a base layer which comprises: an adjacent area disposedadjacent to the second hole; and a sensing area overlapping the displayarea and surrounding the adjacent area; detection electrodes which aredisposed on the sensing area; and a first connection wiring which isdisposed on the adjacent area, the first connection wire electricallyconnecting at least two detection electrodes spaced apart by the secondhole, disposed at respective sides of the second hole.
 2. The displaydevice of claim 1, wherein the detection electrodes comprise: sensingelectrodes arranged in a first direction and connected to each other;and driving electrodes arranged in a second direction perpendicular tothe first direction and connected to each other, wherein at least twodetection electrodes comprise a first driving electrode and a seconddriving electrode spaced apart from each other by the second holeelectrically connected to each other by the first connection wiring. 3.The display device of claim 2, wherein the detection electrodes furthercomprise first connection parts which electrically connect the twoadjacent sensing electrodes to each other, wherein the sensingelectrodes comprise: a first sensing electrode and a second sensingelectrode disposed adjacent to the second hole, wherein the firstconnection parts comprise a first adjacent connection part electricallyconnecting the first sensing electrode and the second sensing electrodeto each other, and wherein the first adjacent connection part isdisposed on a first reference boundary line, the first referenceboundary line spaced apart from the second hole at a reference distance.4. The display device of claim 3, wherein the first connection parts aredisposed along one imaginary line, and the first adjacent connectionpart is disposed at an intersection point of the imaginary line and thefirst reference boundary line.
 5. The display device of claim 4, whereinthe input sensing unit further comprises: pads which are disposed on anon-sensing area of the base layer along edges of the sensing area; andsensing lines which are electrically connected to the pads and aredisposed on the non-sensing area, wherein the first sensing electrodeand the second sensing electrode are electrically connected to two ofthe pads by two of the sensing lines.
 6. The display device of claim 5,wherein a sensing electrode disposed not adjacent to the second hole iselectrically connected to only one of the sensing lines.
 7. The displaydevice of claim 1, wherein the input sensing unit further comprises aguard line which is disposed on the adjacent area of the base layer toform a closed loop along edges of the second hole.
 8. The display deviceof claim 1, wherein each of the sensing electrodes and the firstconnection wiring comprises a transparent conductive pattern, andwherein the first connection wiring comprises a metal conductive patterndisposed on the transparent conductive pattern.
 9. The display device ofclaim 1, wherein the input sensing unit further comprises a sensingwiring which is connected to an end of one of the detection electrodes,and a line width of the first connection wiring is greater than that ofthe sensing wiring.
 10. The display device of claim 1, wherein the inputsensing unit further comprises a second connection wiring which isdisposed on the adjacent area and electrically connecting detectionelectrodes spaced apart by the second hole at respective sides of thesecond hole, wherein the line width of the first connection wiring isdifferent from that of the second connection wiring.
 11. The displaydevice of claim 1, wherein the display unit comprises: a firstsubstrate; a second substrate which is disposed opposing the firstsubstrate; a display element layer which is disposed between the firstsubstrate and the second substrate; and a sealing member which isdisposed between the first substrate and the second substrate tosurround the first hole and seal the first substrate and the secondsubstrate, wherein the first connection wiring overlaps the sealingmember.
 12. The display device of claim 1, further comprising a windowunit which is disposed on the display unit, wherein the window unitcomprises a light shielding pattern overlapping the adjacent area. 13.The display device of claim 1, wherein the display unit compriseswirings overlapping the adjacent area, and the first connection wiringoverlaps at least two of the wirings.
 14. The display device of claim 1,wherein the display unit comprises: a base layer; and a plurality ofdams which are formed adjacent to the first hole, each of the damsforming a closed loop along edges of the first hole, and wherein thefirst connection wiring overlaps at least one of the dams.
 15. Thedisplay device of claim 14, wherein the display unit further comprises agroove formed between the dams, the groove being inversely tapered. 16.A display device comprising: a substrate which comprises a display area,a non-display area disposed surrounding edges of the display area, and afirst hole formed in the display area; a circuit element layer which isdisposed on the substrate and comprises a transistor; a display elementlayer which is disposed on the circuit element layer overlapping thedisplay area, the display element comprising a light emitting elementelectrically connected to the transistor; a thin-film encapsulationlayer which is disposed on the display element layer; and an inputsensing layer which is disposed on the thin-film encapsulation layer,the input sensing layer comprising: detection electrodes overlapping thedisplay area; and a connection wiring electrically connecting detectionelectrodes separated from each other by the first hole among thedetection electrodes, wherein the connection wiring is disposed adjacentto the first hole.
 17. The display device of claim 16, wherein thedetection electrodes comprise a metal conductive layer of a metal meshpattern, wherein a portion of the connection wiring which overlaps oneof the detection electrodes is a metal mesh pattern, and wherein thedetection electrodes do not overlap the light emitting element.
 18. Thedisplay device of claim 16, wherein the detection electrodes comprise:sensing electrodes arranged in a first direction and connected to eachother; and driving electrodes arranged in a second directionperpendicular to the first direction and connected to each other, andwherein a first driving electrode and a second driving electrode spacedapart from each other by the second hole disposed at respective sides ofthe second hole are electrically connected by the connection wiring. 19.The display device of claim 18, wherein the detection electrodes furthercomprise first connection parts which electrically connect the sensingelectrodes to each other, wherein a first sensing electrode and a secondsensing electrode disposed adjacent to the second hole among the sensingelectrodes are electrically connected to each other by a first adjacentconnection part among the first connection parts, and wherein the firstadjacent connection part is disposed on a first reference boundary lineset based on the second hole.
 20. The display device of claim 19,wherein the first connection parts are disposed on one imaginary line,and wherein the first adjacent connection part is disposed at anintersection point of the imaginary line and the first referenceboundary line.